Q-Pixel, a microLED display innovator, has joined Silicon Catalyst, the world’s only incubator focused exclusively on accelerating early-stage semiconductor hardware companies, to accelerate Q-Pixel’s development of their full-color displays manufactured with tunable polychromatic LEDs.
NVIDIA Introduces Generative AI Foundry Service on Microsoft Azure for Enterprises and Startups Worldwide
NVIDIA today introduced an AI foundry service to supercharge the development and tuning of custom generative AI applications for enterprises and startups deploying on Microsoft Azure.
Synopsys Announces Synopsys.ai Copilot, Breakthrough GenAI Capability to Accelerate Chip Design
Synopsys, Inc. today announced a breakthrough generative artificial intelligence (GenAI) capability for accelerating chip design, Synopsys.ai Copilot.
ITEC Introduces the Industry’s Fastest and Most Accurate RFID Inlay Die Bonder
ITEC’s ADAT3 XF Tagliner is the industry’s fastest, and most accurate RFID inlay die bonder.
Imec Grants Public Access to Virtual Fab for Quantifying Environmental Impact of IC Manufacturing
Beyond the ICT industry, imec aims to guide academics and policy makers with actionable data.
PEER Group Celebrates Twenty Years in Europe
PEER Group, the largest supplier of innovative factory automation software products for the semiconductor industry, will be exhibiting at SEMICON Europa 2023.
Busch Vacuum Solutions Acquires centrotherm clean solutions
Busch Vacuum Solutions, one of the largest vacuum pump manufacturers worldwide, has acquired centrotherm clean solutions, one of the technology leaders in industrial gas abatement systems.
Advanced IC Substrates: Taiwanese Companies Lead the Market
Increasing capacity expansion by substrate manufacturers to accommodate the growth of application processors in the AI age.
Lattice Semiconductor Appoints John Forsyth and Que Thanh Dallara to Board of Directors
Lattice Semiconductor, the low power programmable leader, today announced the appointment of Que Thanh Dallara and John Forsyth to the Company’s Board of Directors effective November 14, 2023.
NextFlex Announces $6.5 Million in Funding for Flexible Hybrid Electronics Innovations in Extreme Environments and Sustainability
Projects include developments of additive approaches for complex multilayer 3D electronics, high and low temperature interconnects with proven reliability and in-mold electronics for automotive applications.
