Intel deploys extreme ultraviolet lithography in high-volume manufacturing; use of the technology in Ireland is a first for mass production in Europe.
GlobalFoundries Unveils Power-Efficient Advancements to 22FDX Platform at Annual Tech Summit
This week at its annual Technology Summit in Europe, GlobalFoundries announced advancements to its industry-leading 22FDX (22nm FD-SOI) platform, introducing a suite of innovative features and enhancements.
IDTechEx Analyzes AI and the Road to Full Autonomy in Autonomous Vehicles
The road to fully autonomous vehicles is, by necessity, a long and winding one; systems that implement new technologies that increase the driving level of vehicles (driving levels being discussed further below) must be rigorously tested for safety and longevity before they can make it to vehicles that are bound for public streets.
USPAE, DoD Launch $10 Million Defense Business Accelerator to Innovate Commercialization of Advanced Electronics
In a major initiative to innovate how the Department of Defense (DoD) spurs commercial technology development, the U.S. Partnership for Assured Electronics (USPAE) and DoD launched a Defense Business Accelerator (DBX) to open doors for industrial base growth and stimulate private investment.
Investigation Onboard the Space Station Seeks New Insights Into Cooling Technology for Electronics
The experiment aims to improve the efficiency of heat transfer devices used in various technologies, from laptops to NASA’s Hubble Telescope.
Brooks Instrument Opens New Manufacturing Site in Malaysia
Brooks Instrument has opened a new manufacturing facility in Penang, Malaysia, significantly increasing its operational footprint in Asia-Pacific for producing mass flow controllers (MFCs).
Kneron Announces $49M in Additional Funding, Bringing Total Series B to $97M
Kneron, the San Diego-based full-stack AI company, today announced $49M in strategic funding from investors including Foxconn and Alltek, bringing their total Series B financing to $97 million.
FMI Analyst View: “Shaping the Future of Protection: Hermetic Packaging Solutions”
The hermetic packaging market is poised to increase at a 4.2% CAGR from 2023 to 2033, acquiring a market value of US$ 5.2 billion by the end of 2033, up from US$ 3.4 billion in 2023.
KemLab Inc. Applauds CHIPS Act’s Commitment to Strengthening Semiconductor Supply Chain
KemLab announced its intention to apply for the Fall 2023 funding under the CHIPS Act.
Winbond Introduces Innovative CUBE Architecture for Powerful Edge AI Devices
Winbond Electronics Corporation, a global supplier of semiconductor memory solutions, has unveiled a powerful enabling technology for affordable Edge AI computing in mainstream use cases.
