The first half of $11.6M Microelectronics Commons funding for 5G/6G and Electronic Warfare chip technology to be received by January 2025.
CHIPS Incentives Award with HP to Support Domestic Manufacturing
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded HPI Federal LLC up to $53 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Heraeus Announces Merger
Heraeus is combining the high-performance materials expertise of Heraeus Conamic and Heraeus Comvance into a new operating company: Heraeus Covantics.
Archer Improves Quantum Carbon Film Material
Archer has improved the electron spin lifetime and sample-to-sample repeatability and uniformity for its manufacturable quantum carbon film.
Imec Announces Breakthrough in Electrically Pumped Nano-Ridge Lasers on Silicon
Imec has announced a significant milestone in silicon photonics with the successful demonstration of electrically-driven GaAs-based multi-quantum-well nano-ridge laser diodes fully, monolithically fabricated on 300mm silicon wafers in its CMOS pilot prototyping line.
Sivers Semiconductors Wins a Major Chip Development Program with Leading Tier-1 Telecom Infrastructure Vendor
The $5.4M program will support the development of a next-generation highly-integrated beamforming transceiver for a variety of mmWave telecom applications
Graphene Breakthrough: SEOULTECH’s Laser Technology Unveils Damage-Free Ultrathin Flexible Displays
A new graphene-assisted laser lift-off method keeps ultrathin displays flawless and ready for wearable technology.
Advantest Forms Strategic Partnerships with FormFactor and Technoprobe
Semiconductor test equipment supplier Advantest Corporation announced that it has entered into small minority investments and partnership agreements with both Technoprobe SpA and FormFactor, Inc.
Renesas Introduces New MOSFETs with Exceptional Performance
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today introduced new 100V high-power N-Channel MOSFETs that deliver industry-leading high-current switching performance for applications such as motor control, battery management systems, power management and charging.
NoMIS Power Advances to Phase 2 in American-Made Silicon Carbide Packaging Prize
Prestigious U.S. Department of Energy award will advance the state of the art in semiconductor packaging.
