MRSI Systems, a manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, has launched the MRSI-705HF high force die bonder, a new variant of the proven MRSI-705 platform.
Dr. Lawrence T. Pileggi of Carnegie Mellon University to be Honored With 2023 Phil Kaufman Award
Dr. Lawrence Pileggi, Coraluppi Head and Tanoto Professor of Electrical and Computer Engineering at Carnegie Mellon University, will be honored with the 2023 Phil Kaufman Award for distinguished contributions to Electronic System Design (ESD).
Chiplets Reduce Development Time and Cost
Chiplet Summit announces its second annual event on February 6-8 at the Santa Clara Convention Center.
ROHM’s New EcoGaN Power Stage ICs Contribute to Smaller Size and Lower Loss
ROHM Semiconductor today announced the BM3G0xxMUV-LB series of power stage ICs with built-in 650V GaN HEMTs and gate drivers.
UT and Samsung Partner to Develop Talent Pipeline for Texas’ Semiconductor Ecosystem
Samsung Austin Semiconductor and The University of Texas at Austin are partnering to develop the talent pipeline to support the growing semiconductor ecosystem in Central Texas.
Samsung Electronics Unveils Industry’s Highest-Capacity 12nm-Class 32Gb DDR5 DRAM
Samsung Electronics Co., Ltd. today announced that it has developed the industry’s first and highest-capacity 32-gigabit (Gb) DDR5 DRAM1 using 12 nanometer (nm)-class process technology.
WiMi Developed Digital Holography-Based Semiconductor Wafer Defect Detection Technology
WiMi Hologram Cloud Inc., a global Hologram Augmented Reality Technology provider, today announced that an innovative detection technique based on digital holography has been developed to meet the needs of semiconductor wafer defect detection.
Toshiba Releases 3rd Generation SiC MOSFETs for Industrial Equipment with Four-Pin Package that Reduces Switching Loss
The new products are the first in Toshiba’s SiC MOSFET line-up to use the four-pin TO-247-4L(X) package, which allows Kelvin connection of the signal source terminal for the gate drive.
Analog and Digital: The Best of Both Worlds in One Energy-Efficient System
The fusion of 2D semiconductors and ferroelectric materials could lead to joint digital and analog information processing, with significant improvement in energy consumption, electronic device performance, and lead to novel functionalities.
Semtech and Oxit Team Up to Simplify IoT Device Connectivity
Semtech Corporation and Oxit have announced a collaboration to enable device manufacturers to build a single device with the OxTech Multi-Connectivity Module.
