The 56th International Symposium on Microelectronics (IMAPS 2023) will be held October 2-5, 2023, at the Town & Country Resort in San Diego, California.
Guiding the Design of Silicon Devices With Improved Efficiency
Dr. Kyle Bushick and Professor Emmanouil Kioupakis present a consistent first-principles methodology to study both direct and phonon-assisted Auger-Meitner recombination (AMR) in indirect-gap semiconductors that we apply to investigate the microscopic origin of AMR processes in silicon.
Synopsys Completes Acquisition of PikeTec GmbH
Synopsys, Inc. today announced it has completed the acquisition of PikeTec GmbH. PikeTec is one of the leaders in solutions for the testing and verification of automotive software for control unit systems.
onsemi Appoints Christina Lampe-Önnerud to the Board of Directors
onsemi today announced that Christina Lampe-Önnerud was appointed to its board of directors, effective September 1, 2023.
MACOM Announces Definitive Agreement to Acquire the RF Business of Wolfspeed, Inc.
MACOM Technology Solutions Holdings, Inc., a supplier of semiconductor products, today announced that it has entered into a definitive agreement to acquire the radio frequency business of Wolfspeed, Inc.
SEMI MEMS & Imaging Sensors Summit to Highlight New Innovation Opportunities to Drive a Sustainable Future
More than 40 experts will gather September 19-21 at the SEMI MEMS & Imaging Sensors Summit to share insights into new innovation opportunities for MEMS, imaging and sensors applications and their potential to enable a smarter and more sustainable world.
Silicon Fabricated Parts Market Forecasting High Growth
Increased layer technology and OLED growth driving demand for silicon parts.
Research Team Developing a Nano-Sized Force Sensor and Improving High-Precision Microscopy Technology
Together with the scientists from The Ohio State University OSU, cell biology researchers at Tampere University have developed a force sensor that can be attached to the side of a mechanically responding protein, allowing it to sense forces and strain on the protein within the cell.
SK hynix Develops World’s Best Performing HBM3E
SK hynix Inc. announced today that it successfully developed HBM3E, the next-generation of the highest-specification DRAM for AI applications currently available, and said a customer’s evaluation of samples is underway.
IDTechEx Discusses Chips as Currency: America, China, and the AI Race
Running in the background to the more visible, very real wars occurring around the world at present, there is another, economic and industrial in nature.
