Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Major U.S. 300mm Chip Manufacturer Selects EAGLEi 300 FOUP Inspection Technology for Leading Edge Production

SHELLBACK Semiconductor Technology, at the forefront of supplying capital equipment solutions to emerging semiconductor markets worldwide, announced today the sale of their popular EAGLEi 300 FOUP Inspection System to a major 300mm chip manufacturer in the US.

Blueshift Memory Announces Flash Memory Summit Best in Show Award for Cambridge Architecture

Blueshift Memory, designer of a novel proprietary high-speed memory architecture, has announced that the Cambridge Architecture has been selected to receive the Most Innovative Memory Technology award in the Memory Accelerator Architecture category at last week’s Flash Memory Summit Best in Show Awards in Santa Clara – the world’s largest computer memory event.

Creative and xMEMS Labs Partner to Deliver Superior High-Fidelity TWS Earbuds

Creative Technology announced a strategic partnership with xMEMS Labs, bringing in a new era of audio excellence for users worldwide by incorporating xMEMS’ micro-electro-mechanical system (MEMS) solid-state speaker technology into Creative’s True Wireless Stereo (TWS) products.

Synopsys Announces Sassine Ghazi to Assume President and CEO Role Jan. 1, 2024

Synopsys, Inc. today announced that its Board of Directors has appointed Sassine Ghazi as president and Chief Executive Officer effective on Jan. 1, 2024.

Novel Lateral Data Storage: Two-Dimensional Ferroelectric Semiconductor Memory with a Bottom Contact 100nm Channel Using In-Plane Polarization

Traditional memory technologies face limitations in terms of speed, scalability, and power consumption, making them unsuitable for future data-intensive applications.

Layered and Traditional Semiconductors Heterogenous Integration Open Door for Post Moore Era

Scientists in NEXT Lab, Tsinghua University have revealed the fabrication and engineering techniques of TMDs and provided a comparative view between TMDs and traditional semiconductors, demonstrating the benefit of combining TMDs with traditional semiconductors.

Foothill College and the Krause Center for Innovation Collaborate to Propel Students into the Semiconductor Industry

In an ambitious move to bridge the talent gap in the semiconductor industry, Foothill College and the Krause Center for Innovation (KCI) announce a special screening of the docuseries “Chip In: Roadtrip Nation.”

Intel Announces Termination of Tower Semiconductor Acquisition

Intel Corporation today announced that it has mutually agreed with Tower Semiconductor to terminate its previously disclosed agreement to acquire Tower due to the inability to obtain in a timely manner the regulatory approvals required under the merger agreement, dated Feb. 15, 2022.​

Tachyum Achieves 192-Core Chip After Switch to New EDA Tools

Tachyum today announced that new EDA tools, utilized during the physical design phase of the Prodigy Universal Processor, have allowed the company to achieve significantly better results with chip specifications than previously anticipated, after the successful change in physical design tools – including an increase in the number of Prodigy cores to 192.

Kneron Unveils the KL730 AI Chip, Propelling Low-Energy GPT Solutions at Scale

Kneron, the San Diego-based full stack AI company known for pioneering neural processing units (NPUs), is today announcing the launch of KL730, an auto-grade NPU chip with an integrated Image Signal Processor (ISP), bringing secure, low-energy AI capabilities to a wide range of applications, from enterprise-edge servers to smart home appliances and advanced driving assistance systems.