Cadence Design Systems, Inc. today announced that the Cadence EMX 3D Planar Solver is now certified for use with Samsung Foundry’s advanced 8nm Low Power Plus (LPP) process technology.
ROHM Completes Acquisition of New Production Site
ROHM Semiconductor this week announced they have completed acquisition of the assets of Solar Frontier’s former Kunitomi Plant located in Japan, based on its basic agreement signed with Solar Frontier.
CEA-Leti Will Present Gains in Ultimate 3D, RF & Power, and Quantum & Neuromorphic Computing with Emerging Devices
Institute to host annual Leti Devices Workshop on Dec. 10: ‘Semiconductor Devices: Moving Towards Efficiency & Sustainability’
Chipshub: An Online Platform for Everything Semiconductors
Purdue University is leveraging its expertise in scientific simulation tools to help the nation take the lead as the hub for semiconductors and chips research, development and manufacturing.
FPGA Market Set to Reach $13.6B by 2031 with a Strong 8.1% CAGR
The global FPGA Market was estimated at a value of US$ 6 billion in 2020.
ClassOne Technology Receives Order for Solstice S8 Single-Wafer System from Finland’s VTT Technical Research Centre
Prominent European research institution to leverage Solstice platform’s leading-edge electroplating technology for advanced packaging applications.
Department of Commerce Reaches Agreement with New Organization, SemiUS, to Operate National Semiconductor Technology Center (NSTC)
Today, the Department of Commerce announced it has reached an initial agreement with a new nonprofit organization called SemiUS, the expected operator for the National Semiconductor Technology Center (NSTC).
ROHM’s New Ultra-High-Speed Gate Driver IC: Maximizing the Performance of GaN Devices
ROHM Semiconductor today introduced the new BD2311NVX-LB gate driver IC, optimized for GaN devices, which achieves gate drive speeds on the order of nanoseconds (ns), ideal for high-speed switching.
Micron First to Enable Ecosystem Partners With the Fastest, Lowest Latency High-Capacity 128GB RDIMMs Using Monolithic 32Gb DRAM
Micron Technology, Inc. today demonstrated its industry leadership by announcing its 32Gb monolithic die-based 128GB DDR5 RDIMM memory featuring best-in-class performance of up to 8000 MT/s1 to support data center workloads today and into the future.
ACM Research Celebrates Opening of New Oregon Facility
ACM Research, Inc. today announced the grand opening of its new multi-use facility in Hillsboro, Ore., on November 28.
