Semiconductor Industry Association (SIA) President and CEO John Neuffer today released the following statement regarding the one-year anniversary of enactment of the CHIPS and Science Act, a landmark law that provides $52 billion for semiconductor manufacturing incentives and research initiatives.
Simple Ballpoint Pen Can Write Custom LEDs
Researchers have developed ink pens that allow individuals to handwrite flexible, stretchable optoelectronic devices on everyday materials including paper, textiles, rubber, plastics and 3D objects.
IDTechEx Discusses Next-Generation RDL Materials in Advanced Semiconductor Packaging
With the ever-increasing demand for higher performance and efficiency in electronic devices, the semiconductor industry is constantly pushing the boundaries of packaging technology.
Nordson’s Semiconductor Advanced Packaging Solutions Will Be Demonstrated at SEMICON Taiwan 2023
Nordson Electronics Solutions will demonstrate the latest solutions for semiconductor advanced packaging at the SEMICON Taiwan tradeshow booth L0800, Hall 1, 4th floor.
TSMC to Build Multi-Billion-Euro Chip Factory in Germany
Taiwanese semiconductor manufacturer TSMC plans to construct a massive new production facility in the eastern German city of Dresden.
NEO Semiconductor 3D X-DRAM Awarded “Best of Show” for Most Innovative Memory Technology
NEO Semiconductor, a developer of innovative technologies for 3D NAND flash and DRAM memory, today announced that its ground-breaking technology, 3D X-DRAM, captured the top prize at Flash Memory Summit 2023, winning the “Best of Show” award for the Most Innovative Memory Technology.
Researchers Discover a Potential Application of Unwanted Electronic Noise in Semiconductors
Random telegraph noises in vanadium-doped tungsten diselenide can be tuned with voltage polarity.
Membrion Series B Round Closes at $12.5M
Samsung Ventures and Lam Capital invest in Membrion sustainable solutions for industrial and semiconductor wastewater.
Governor Hochul Announces the Establishment of World-Class AMD Design Centers in New York State
High-performance semiconductor design company commits to creating 165 new jobs in two New York State locations.
Intel Federal, Qorvo, Ayar Labs, and Lockheed Martin ATL Win Co-Packaged Analog-Drive High-Bandwidth Optical Input/Output (KANAGAWA) Prototype Project
The Strategic and Spectrum Missions Advanced Resilient Trusted Systems (S²MARTS) OTA announced Ayar Labs, Intel, Lockheed Martin ATL, and Qorvo are the prime awardees of the Co-Packaged Analog-Drive High-Bandwidth Optical Input/Output (KANAGAWA) prototype project.
