Lavorro announced its strategic Distribution and Support Agreement with BISTelligence for deploying and supporting Lavorro software products on the Semiconductor Tools and in the Fabs.
AI-Based Technique for Predicting Crystal Orientation Improves the Efficiency of Manufacturing Most Electronic Devices
A team led by Nagoya University researchers in Japan has successfully predicted crystal orientation by teaching an artificial intelligence (AI) using optical photographs of polycrystalline materials. The results were published in APL Machine Learning.
Researchers Grow Precise Arrays of NanoLEDs
A new technique produces perovskite nanocrystals right where they’re needed, so the exceedingly delicate materials can be integrated into nanoscale devices.
SkyWater CEO Thomas Sonderman to Deliver Keynote at SEMICON West
SkyWater Technology today announced its President and CEO, Thomas Sonderman will provide a keynote at SEMICON West 2023 on July 13th.
Transphorm Confirms Gallium Nitride Materials Sources Are Secure
Transphorm, Inc. today responded to the recent news regarding China export restrictions.
REVASUM Announces the Release of 200mm Conversion Kit for 6EZ SiC CMP platform
Revasum today announced the availability of 200mm SiC wafer polishing capability on the 6EZ platform.
ChipFlow Raises £1.2M in Pre-Seed Funding to Democratize Semiconductor Design Through Open-Source Software Tools
The oversubscribed financing round, which was led by Fontinalis Partners, includes participation from Fuel Ventures, InMotion Ventures, the investment arm of JLR, APX, and others.
3D-Micromac to Present Breakthroughs in Laser Micromachining for Semiconductor Manufacturing and Advanced Packaging at SEMICON West
Power devices, magnetic sensors, microLEDs, and advanced packaging among myriad applications enabled by 3D-Micromac’s laser micromachining solutions.
Renesas and Wolfspeed Sign 10 Year Silicon Carbide Wafer Supply Agreement
The supply of high-quality silicon carbide wafers from Wolfspeed will pave the way for Renesas to scale production of silicon carbide power semiconductors starting in 2025.
IDTechEx Explores Materials and Processing for Advanced Semiconductor Packaging
Semiconductor packaging has evolved from board-level to wafer-level integration, bringing notable advancements.
