Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

USPAE, DoD Launch $10 Million Defense Business Accelerator to Innovate Commercialization of Advanced Electronics

In a major initiative to innovate how the Department of Defense (DoD) spurs commercial technology development, the U.S. Partnership for Assured Electronics (USPAE) and DoD launched a Defense Business Accelerator (DBX) to open doors for industrial base growth and stimulate private investment.

Investigation Onboard the Space Station Seeks New Insights Into Cooling Technology for Electronics

The experiment aims to improve the efficiency of heat transfer devices used in various technologies, from laptops to NASA’s Hubble Telescope.

Brooks Instrument Opens New Manufacturing Site in Malaysia

Brooks Instrument has opened a new manufacturing facility in Penang, Malaysia, significantly increasing its operational footprint in Asia-Pacific for producing mass flow controllers (MFCs).

Kneron Announces $49M in Additional Funding, Bringing Total Series B to $97M

Kneron, the San Diego-based full-stack AI company, today announced $49M in strategic funding from investors including Foxconn and Alltek, bringing their total Series B financing to $97 million.

FMI Analyst View: “Shaping the Future of Protection: Hermetic Packaging Solutions”

The hermetic packaging market is poised to increase at a 4.2% CAGR from 2023 to 2033, acquiring a market value of US$ 5.2 billion by the end of 2033, up from US$ 3.4 billion in 2023.

KemLab Inc. Applauds CHIPS Act’s Commitment to Strengthening Semiconductor Supply Chain

KemLab announced its intention to apply for the Fall 2023 funding under the CHIPS Act.

Winbond Introduces Innovative CUBE Architecture for Powerful Edge AI Devices

Winbond Electronics Corporation, a global supplier of semiconductor memory solutions, has unveiled a powerful enabling technology for affordable Edge AI computing in mainstream use cases.

Cadence Digital and Custom/Analog Design Flows Achieve the Latest TSMC N2 Certification

Cadence Design Systems, Inc. today announced its digital and custom/analog flows have achieved certification for TSMC’s latest N2 Design Rule Manual (DRM).

Keysight, Synopsys, and Ansys Accelerate RFIC Semiconductor Design with New Reference Flow for TSMC’s Advanced 4nm RF FinFET Process

Keysight Technologies, Inc., Synopsys, Inc, and Ansys announced a new reference flow for the TSMC N4PRF, the world’s leading semiconductor foundry’s advanced 4 nanometer (nm) radio frequency (RF) FinFET process technology.

GlobalFoundries and Microchip Announce Microchip’s 28nm SuperFlash Embedded Flash Memory Solution in Production

GlobalFoundries and Microchip Technology, via its Silicon Storage Technology (SST) subsidiary, today announces the immediate release to production of the SST ESF3 third-generation embedded SuperFlash non-volatile memory (NVM) solution in the GF 28SLPe foundry process.