High-capacity Li-rich oxide materials have gained attention for their unique anion-cation charge compensation. Yet, high operating voltage, cycling issues, unsafe oxygen evolution, and voltage decay hinder industrial use.
Artificial Intelligence Designs Advanced Materials
Artificial intelligence (AI) is playing an increasingly pivotal role in designing new alloys.
SIA Statement on Outbound Investment Proposal
The Semiconductor Industry Association (SIA) today released the following statement regarding new administration actions related to outbound investment screening.
CEVA Joins Samsung SAFE Foundry Program
CEVA, Inc., the licensor of wireless connectivity and smart sensing technologies and custom SoC solutions, today announced that it has joined the Samsung Advanced Foundry Ecosystem (SAFE) to streamline chip design and accelerate time-to-market for CEVA licensees using Samsung’s advanced foundry processes.
Greene Tweed Introduces Chemraz G57 Premium Elastomer
Greene Tweed, a global manufacturer of high-performance sealing solutions and engineered components, announces the introduction of Chemraz G57, a perfluoroelastomer that Greene Tweed material scientists and application engineers specifically developed to meet the demands of aggressive dry plasma systems and other extremely demanding semiconductor fabrication sealing applications.
Biden-Harris Administration Making Progress One-Year into CHIPS for America
This week marked the one-year anniversary of President Biden signing the bipartisan CHIPS and Science Act into law as part of his investing in America agenda.
One Year After Enactment, CHIPS & Science Act is on Path to Success; Work Remains to Maximize Impact
Semiconductor Industry Association (SIA) President and CEO John Neuffer today released the following statement regarding the one-year anniversary of enactment of the CHIPS and Science Act, a landmark law that provides $52 billion for semiconductor manufacturing incentives and research initiatives.
Simple Ballpoint Pen Can Write Custom LEDs
Researchers have developed ink pens that allow individuals to handwrite flexible, stretchable optoelectronic devices on everyday materials including paper, textiles, rubber, plastics and 3D objects.
IDTechEx Discusses Next-Generation RDL Materials in Advanced Semiconductor Packaging
With the ever-increasing demand for higher performance and efficiency in electronic devices, the semiconductor industry is constantly pushing the boundaries of packaging technology.
Nordson’s Semiconductor Advanced Packaging Solutions Will Be Demonstrated at SEMICON Taiwan 2023
Nordson Electronics Solutions will demonstrate the latest solutions for semiconductor advanced packaging at the SEMICON Taiwan tradeshow booth L0800, Hall 1, 4th floor.
