Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Synopsys and TSMC Streamline Multi-Die System Complexity with Unified Exploration-to-Signoff Platform and Proven UCIe IP on TSMC N3E Process

Synopsys, Inc. today announced it is extending its collaboration with TSMC to advance multi-die system designs with a comprehensive solution supporting the latest 3Dblox 2.0 standard and TSMC’s 3DFabric technologies.

GlobalFoundries Submits Applications for U.S. CHIPS and Science Act Funding

GlobalFoundries announced today it has applied for U.S. CHIPS and Science Act Funding, with two full applications submitted to the CHIPS Program Office of the U.S. Department of Commerce.

Synopsys Unveils Industry’s Broadest Portfolio of Automotive-Grade IP on TSMC’s N5A Process Technology

Today, Synopsys, Inc. announced the industry’s broadest portfolio of automotive-grade Interface and Foundation IP for TSMC’s N5A process.

Purdue’s Semiconductor Innovation Ecosystem Grows With CHIPS-funded, Indiana-led Semiconductor Hub With Upcoming Summit

Purdue University continues building momentum as America’s leading university in semiconductors, with a broad range of updates this fall semester.

Samsung Electronics’ Industry-First LPCAMM Ushers In Future of Memory Modules

Samsung’s groundbreaking development for its 7.5 gigabits-per-second (Gbps) LPCAMM has completed system verification through Intel’s platform. 

Semiconductor Supply Chain Problems Running Rampant?

Solutions to mitigate future materials supply vulnerabilities.

Synopsys and TSMC Advance Analog Design Migration with Reference Flow Across Advanced TSMC Processes

Synopsys, Inc. today announced its analog design migration flow is enabled across TSMC’s advanced process technologies, including N4P, N3E, and N2.

SEMI North America Advisory Board Welcomes New Members From Axcelis, Edwards Vacuum, Lam Research and Teradyne

SEMI today announced the election of four new members to the SEMI North America Advisory Board.

Lam Research Supports Youth from 200 Countries to Compete in Pioneering Innovation Challenge Addressing Climate Change

The 2023 FIRST Global Challenge will in a few weeks bring together thousands of teens from across the globe to compete in robotics and collaborate to find renewable energy solutions.

Omdia: Manufacturers from China Have Increased Their Dominance in the Auto Display Market, Holding a 45% Market Share in 1H23

Chinese companies have emerged as the top suppliers in the automotive display market in the first half of 2023, extending their dominance in the displays industry after also dominating the TV and smartphone display markets.