Micron Technology, Inc. announced today that it is now delivering qualification samples of its Universal Flash Storage (UFS) 4.0 mobile solution, built on its advanced 232-layer 3D NAND.
AI Advancements Propel NVIDIA to Elite Trillion-Dollar Club, Says GlobalData
Riding on the growing demand for generative artificial intelligence (AI) tools, US-based semiconductor giant Nvidia had briefly vaulted past the $1 trillion market capitalization mark.
Advantest, NXP and Arizona State University Collaborate to Launch New Test Engineering Curriculum
Advantest Corporation and Arizona State University today announced their collaboration with global semiconductor company NXP Semiconductors to create a new, “first-of-its-kind” test engineering course at ASU.
AMD Announces Plan to Invest $135 Million to Expand Adaptive Computing Research, Development and Engineering Operations in Ireland
AMD today announced plans for continued growth in Ireland through an investment of up to $135 million over four years.
Finwave Semiconductor Appoints Dr. Pierre-Yves Lesaicherre as New CEO
Finwave Semiconductor, Inc. today announced that Dr. Pierre-Yves Lesaicherre has joined the company as its chief executive officer.
Technical University of Denmark Installs New Takano Wafer Particle Measurement System from ClassOne Equipment
ClassOne Equipment announced the sale of its advanced new Takano WM-7SR particle measurement system to the DTU Nanolab at the Technical University of Denmark.
Sourceability Launches Digital Pricing Solution for Managing Excess Inventory
Sourceability, a global distributor of electronic components, today announced the launch of its Excess Inventory Estimator.
Lam Research Introduces World’s First Bevel Deposition Solution to Increase Yield in Chip Production
Lam Research Corp. today introduced Coronus DX, the industry’s first bevel deposition solution optimized to address key manufacturing challenges in next-generation logic, 3D NAND and advanced packaging applications.
Airbus and STMicroelectronics Collaborate on Power Electronics for Aircraft Electrification
Airbus and STMicroelectronics have signed an agreement to cooperate on power electronics Research & Development to support more efficient and lighter power electronics, essential for future hybrid-powered aircraft and full-electric urban air vehicles.
Applied Materials Charts Progress Towards Environmental, Social and Governance Goals in Latest Sustainability Report
Applied Materials, Inc. today announced the publication of its latest Sustainability Report, detailing its ESG (environmental, social and governance) initiatives and results over the past year.
