Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

ITRI Set to Strengthen Taiwan-UK Collaboration on Semiconductors

The newly established Department for Science, Innovation and Technology (DSIT) in the UK has recently released the UK’s National Semiconductor Strategy.

Intel, German Government Agree on Increased Scope for Wafer Fabrication Site in Magdeburg

Intel and the German federal government have signed a revised letter of intent for Intel’s planned leading-edge wafer fabrication site in Magdeburg, the capital of Saxony-Anhalt state in Germany.

OMNIVISION Adds Two New Products to Its Broad Family of Global Shutter Sensors

OMNIVISION today announced two new additions to its Nyxel near-infrared (NIR) technology family.

RED Semiconductor Adds David Harold to Management Team

RED Semiconductor, a fabless semiconductor company, has added David Harold to the management team as Head of Business Development.

Vitesco Technologies and ROHM Sign a Long-Term SiC Supply Partnership

Vitesco Technologies, an international manufacturer of modern drive technologies and electrification solutions, has secured strategically important capacities in energy-efficient silicon carbide power semiconductors through a long-term supply partnership with ROHM – worth over one billion US dollars until 2030.

Extending Moore’s Law: CEA-Leti & Intel to Develop Atomically Thin 2D TMDs on 300mm Wafers Using Layer Transfer Technology for Future Transistor Scaling

CEA-Leti and Intel today announced a joint research project to develop layer transfer technology of two-dimensional transition-metal dichalcogenides (2D TMDs) on 300mm wafers with the goal to extend Moore’s Law beyond 2030.

New Robotics Lab to be Created at Maynooth University

Intel and Maynooth University continue to partner through education and research with co-funding for new robotics lab.

Intel Plans Assembly and Test Facility in Poland

Investment near Wrocław, Poland, will help create a first-of-its-kind end-to-end leading-edge manufacturing semiconductor value chain in Europe.

Lenovo Grows AI Infrastructure Revenue to Over US$2 Billion

Lenovo announced it has reached record annual AI infrastructure revenue of over US$2 billion and unveiled the next phase of its growth strategy, with an additional US$1 billion investment over three years to accelerate artificial intelligence (AI) deployment for businesses around the world.

Renesas Updates Progress One Year After Reality AI Acquisition

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today provided an update on its progress in providing artificial intelligence (AI) and tiny machine learning (TinyML) solutions one year after announcing its acquisition of Reality Analytics, Inc. (Reality AI), an embedded AI provider.