Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Electronic System Design Industry Posts $4.7 Billion in Revenue in Q2 2024, ESD Alliance Reports

Electronic System Design (ESD) industry revenue increased 18.2% to $4,685.5 million in the second quarter of 2024 from the $3,962.7 million registered in the second quarter of 2023, the ESD Alliance, a SEMI Technology Community, announced today.

Inflection AI and Intel Launch Enterprise AI System

Today, Inflection AI and Intel announced a collaboration to accelerate the adoption and impact of AI for enterprises as well as developers.

Bruker Introduces Neuroscience Research Solution with High-Speed OptoVolt Voltage Imaging

At the Neuroscience 2024 conference, Bruker Corporation today announced the release of the OptoVolt module to further expand the advanced neuroscience research capabilities on Bruker’s Ultima multiphoton microscope platform.

Global Semiconductor Sales Increase 20.6% Year-to-Year in August

The Semiconductor Industry Association (SIA) today announced global semiconductor sales hit $53.1 billion during the month of August 2024, an increase of 20.6% compared to the August 2023 total of $44.0 billion and 3.5% more than the July 2024 total of $51.3 billion.

Sony Semiconductor Solutions to Release CMOS Image Sensor for Automotive Cameras

Sony Semiconductor Solutions Corporation (SSS) today announced the upcoming release of the ISX038 CMOS image sensor for automotive cameras, the industry’s first product that can simultaneously process and output RAW and YUV images.

Amkor and TSMC to Expand Partnership and Collaborate on Advanced Packaging in Arizona

Amkor Technology, Inc. and TSMC announced today that the two companies have signed a memorandum of understanding to collaborate and bring advanced packaging and test capabilities to Arizona, further expanding the region’s semiconductor ecosystem.

UVA Awarded $8M DARPA Grant to Develop Next-Generation Optical Detectors

The University of Virginia has been awarded an $8 million grant from the Defense Advanced Research Projects Agency to lead a groundbreaking project aimed at developing next-generation optical detectors.

OMNIVISION Expands TheiaCel Product Portfolio with New 12MP-resolution Image Sensor

OMNIVISION today debuted its OX12A10 12-megapixel (MP)-resolution CMOS image sensor with TheiaCel technology at AutoSens Europe 2024.

Samsung Starts Mass Production of Industry’s Most Powerful PC SSD Optimal for AI Applications

Samsung Electronics today announced it has begun mass producing PM9E1, a PCle 5.0 SSD with the industry’s highest performance and largest capacity.

RTX to Develop Ultra-Wide Bandgap Semiconductors for DARPA

New class of materials offer improved conductivity and thermal management properties.