Sagence AI today emerged from stealth unveiling a groundbreaking advanced analog in-memory compute architecture that directly addresses the untenable power/performance/price and environmental sustainability conundrum facing AI inferencing.
Applied Materials Announces New Collaboration Model for Advanced Packaging at Summit on Energy-Efficient Computing
Company convenes top semiconductor R&D leaders to advance high-performance, low-power AI chip packaging technologies.
CHIPS for America Announces New Proposed $285 Million Award for CHIPS Manufacturing USA Institute for Digital Twins
The Biden-Harris Administration announced that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Department to provide SRC $285 million to establish and operate a Manufacturing USA institute headquartered in Durham, North Carolina.
TetraMem Inc and SK hynix Announce Research Partnership
Today, TetraMem Inc & SK hynix Inc announced that they have signed an SOW outlining their partnership on a joint research project to advance the promise of in-memory computing (IMC) for AI applications.
JEDEC Announces Enhanced NAND Flash Interface Standard With Increased Speeds and Efficiency
JEDEC Solid State Technology Association today announced the publication of JESD230G: NAND Flash Interface Interoperability Standard.
NVIDIA Accelerates Google Quantum AI Processor Design With Simulation of Quantum Device Physics
NVIDIA today announced it is working with Google Quantum AI to accelerate the design of its next-generation quantum computing devices using simulations powered by the NVIDIA CUDA-Q platform.
FormFactor Receives SK hynix Best Partner Award
FormFactor, Inc., a supplier of electrical test and measurement solutions for the semiconductor industry, announced today that it has been recognized as an outstanding partner by SK hynix, a global leader in DRAM and Flash memory manufacturing.
TechSearch International Analyzes Hybrid Bonding Developments and Panel Market Growth
In its latest Advanced Packaging Update, TechSearch International provides an update on developments in hybrid bonding including applications, technical challenges, and proposed solutions. The report focuses on hybrid bonding for high-performance applications.
AlixLabs Awarded 345,000€ Swedish Innovation Agency Grant
Funds awarded from Swedish innovation agency’s “Acceleration of deep tech companies 2024” call.
SEMI Europe Recognizes Schneider Electric as a Leader in Diversity and Inclusion at SEMICON Europa 2024
SEMI Europe and the SEMI European Advisory Council for Diversity and Inclusion announced Schneider Electric as the recipient of the 2023 SEMI Industry Leader in Diversity and Inclusion Award.
