MACOM Technology Solutions Holdings announced today that it has acquired ENGIN-IC, Inc., a fabless semiconductor company that designs advanced Gallium Nitride monolithic microwave integrated circuits and integrated microwave assemblies located in Plano, Texas and San Diego, California.
Compound Semiconductor Materials Market Size to Surpass USD 60.75 Billion by 2033
Compound semiconductors are formed when two or more elements from separate or the same group on the periodic table are brought together and combined. Due to the increased demand for applications on electronic and mobile devices, it has experienced phenomenal growth over the past few years.
Empower Semiconductor Showcases Cutting-Edge Vertical Power Architecture for AI and HPC Processors at electronica 2024
Empower Semiconductor will demonstrate its new Crescendo platform with FinFast technology at electronica 2024, the world’s leading trade fair and conference for electronics.
Alchip Announces Successful 2nm Test Chip Tapeout
Joins the first wave of new semiconductor transistor architecture development.
European Chips Skills Academy Unveils Comprehensive Skills Strategy to Boost Competitiveness of Semiconductor Ecosystem
The European Chips Skills Academy (ECSA), an EU-funded initiative coordinated by SEMI, today announced the publication of the Skills Strategy report by DECISION Etudes & Conseil that outlines the strategic approaches required to tackle Europe’s growing talent shortage in the semiconductor sector.
MACOM Selected to Lead Advanced GaN-on-SiC Semiconductor Technology Development Project
MACOM Technology Solutions Inc. today announced that it has been selected to lead a development project to establish advanced gallium nitride (“GaN”) on silicon carbide (SiC) process technologies for radio frequency (“RF”) and microwave applications.
Tenstorrent Expands Deployment of Arteris’ Network-on-Chip IP to Next-Generation of Chiplet-Based AI Solutions
Arteris’ FlexNoC interconnect IP optimizes the on-chip communication flow supporting superior performance, power and area for advancing AI chip and chiplet computing.
CMP Ancillaries to Double in 2025
Recovery in wafer volumes and fab expansions to drive demand.
Pfeiffer Vacuum+Fab Solutions Introduces New Handheld Measuring Gauge
Pfeiffer Vacuum+Fab Solutions – a member of the Busch Group – introduces the TPG 202 Neo, a new Piezo/Pirani handheld gauge designed to meet the demands of various industrial and laboratory environments.
Emerging Trends and Key Markets in 2.5D and 3D Semiconductor Packaging Technologies
This article explores the technology development trends in 2.5D and 3D packaging technologies and the key market growth drivers.
