Bumping technologies for advanced semiconductor packaging have evolved significantly to address the challenges posed by shrinking contact pitches and the limitations associated with conventional flip-chip soldering.
Micron Selects Nutanix Cloud Platform for Its Manufacturing Facilities Globally
Nutanix today announced that Micron Technology, an industry leader in innovative memory and storage solutions, selected Nutanix to build a cloud platform for Micron’s manufacturing facilities globally.
Empire State Development Announces Application Window is Now Open for Luminate NY Accelerator and Business Competition
Empire State Development (ESD) today announced that Luminate NY—the world’s largest business accelerator for startup companies that have optics, photonics, and imaging (OPI) enabled technologies—is now accepting applications for its seventh cohort.
A Brightly (Multi)colored Future for Electrochromic Devices Shines Ahead
Vivid displays, enriched color variations and boosted stability are something everyone can look forward to encountering as advances are made in the electrochromic device (ECD) field.
Archer’s Biochip gFET Design for Advanced Sensing Validated by Commercial Foundry Partner
Archer Materials’ commercial foundry partner in the Netherlands has validated its advanced biochip gFET design by manufacturing the chips using whole four-inch wafer semiconductor fabrication processes.
Vietnam Thriving Semiconductor Industry Fuels Economic Resilience Amidst Global Challenges
Vietnam’s semiconductor industry, bolstered by significant investments from industry giants like Samsung and Intel, and the relocation of major manufacturers from China, has partly helped the country shine amidst a global economic downturn.
Aqua Membranes Collaborates with Micron Technology
Aqua Membranes, a water technology company specializing in sustainable reuse, is sharing preliminary results of an ongoing pilot project with memory chip giant, Micron Technology, Inc.
Samsung Electro-Mechanics Begins Mass Production of the Industry’s First Thin-Film Coupled Power Inductor
On September 10, Samsung announced that it will commence mass production of coupled power inductors, which integrate two power inductors into a single chip.
Cadence Accelerates On-Device and Edge AI Performance and Efficiency with New Neo NPU IP and NeuroWeave SDK for Silicon Design
Cadence Design Systems, Inc. today unveiled its next-generation AI IP and software tools to address the escalating demand for on-device and edge AI processing.
Microchip Teams Up with Intelligent Hardware Korea
To address the rapid rise of Artificial Intelligence (AI) computing at the edge of the network and its associated inferencing algorithms, Intelligent Hardware Korea (IHWK) is developing a neuromorphic computing platform for neurotechnology devices and field programmable neuromorphic devices.
