This collaboration can deliver highly optimized SoCs across various market segments.
ACM Research Introduces Vacuum Cleaning Platform Targeting the Rapidly Growing Chiplets Industry
The new tool, which was developed in collaboration with several key customers, has demonstrated excellent process performance with no flux residual remaining post-clean.
Melexis Boosts Accuracy of Hall-Effect DC Current Sensing
Melexis launches the MLX91230, the first product of its third generation of current sensors.
Omnitron Sensors Selects Silex Microsystems for Reliable MEMS Scanner for LiDAR
Omnitron Sensors, the pioneer in MEMS sensing technology for high-volume, low-cost markets, today announced that it will work with Silex Microsystems on the manufacture of its microelectromechanical systems (MEMS) scanner for LiDAR.
ASMC 2024 Call for Abstract Submissions Opens
The annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is now accepting abstract submissions for its 2024 event, May 13-16, in Albany, New York.
xMEMS Accelerates Global Growth with Launch of New Seminar Series
Announcement of the new seminar series signals a significant expansion of xMEMS in China while continuing its growth throughout Asia, North America, and Europe.
2024 Global Fab Equipment Spending Recovery Expected After 2023 Slowdown, SEMI Reports
Global fab equipment spending for front-end facilities in 2023 is expected to decline 15% year-over-year (YoY) to US$84 billion from a record high of US$99.5 billion in 2022 before rebounding 15% YoY to US$97 billion in 2024.
GSA Women’s Leadership Initiative Announces the Dr. Lisa Su Woman of Innovation Award Recipient
This award will be presented at the Women in Semiconductor Hardware, WISH, Conference on October 12, 2023.
BizLink Receives 2023 Supplier Award from Lam Research
BizLink announced it has been recognized with a 2023 Supplier Award from Lam Research, a global supplier of innovative wafer fabrication equipment and services to the semiconductor industry.
MediaTek Successfully Develops First Chip Using TSMC’s 3nm Process, Set for Volume Production in 2024
MediaTek and TSMC today announced that MediaTek has successfully developed its first chip using TSMC’s leading-edge 3nm technology, taping out MediaTek’s flagship Dimensity system-on-chip (SoC) with volume production expected next year.
