Researchers at Oregon State University and Baylor University have made a breakthrough toward reducing the energy consumption of the photonic chips used in data centers and supercomputers.
Ayar Labs Adds $25 Million in Expansion of Its $130 Million Series C
Ayar Labs today announced it has raised an additional $25 million in Series C1 funding, bringing its total Series C raise to $155 million.
Semiconductor Chemical Revenues Fall as Energy Prices Rise
Wet chemical market decline follows wafer start slowdown.
EV Group and Dymek Company Form Joint Venture Company in Malaysia
EV Group and Dymek Company today announced that they have established a new joint venture company in Malaysia.
SEMI North America Advisory Board Welcomes New Members From ASML and Breker Verification Systems
SEMI today announced the election of two new members to the SEMI North America Advisory Board (NAAB): Maheen Hamid, co-founder, CFO and COO of Breker Verification Systems, and Michael Lercel, Senior Director of Global Strategic Marketing at ASML.
Applied Materials Convenes Leaders from Industry, Academia and Government at “Summit to Advance Semiconductor Leadership”
Applied Materials, Inc. today hosted the Summit to Advance Semiconductor Leadership – an event focused on exploring solutions for overcoming key challenges facing the semiconductor industry on its path to becoming a $1 trillion market over the next decade.
NVIDIA Collaborates With Microsoft to Accelerate Enterprise-Ready Generative AI
NVIDIA today announced that it is integrating its NVIDIA AI Enterprise software into Microsoft’s Azure Machine Learning to help enterprises accelerate their AI initiatives.
Global Semiconductor Packaging Materials Market to Near $30 Billion by 2027
Powered by strong demand for new electronics innovations, the global semiconductor packaging materials market is expected to reach US$29.8 billion by 2027, a compound annual growth rate (CAGR) of 2.7% from the US$26.1 billion in revenue it logged in 2022.
Imec First to Demonstrate Conductor Films on 300mm Wafers with Lower Resistivity than Cu and Ru
This week, at the 2023 IEEE International Interconnect Technology Conference (2023 IEEE IITC), imec provides the first experimental evidence that the resistivity of a thin conductor film on a 300mm Si wafer can be lower than that of Cu and Ru, which are currently used in interconnect metallization schemes.
XlynX Crosslinker Enables Ultra-Stable Perovskite Solar Cells
The past decade has seen remarkable progress in the field of perovskite solar cells (PSCs), a next-generation technology that offers a lower cost and easier to manufacture alternative to conventional silicon solar cells.
