SEMICON Southeast Asia opens tomorrow with critical semiconductor industry topics including supply chain resilience, sustainability, Smart Manufacturing, Smart Mobility, Smart MedTech, and workforce development in focus.
NY CREATES Announces New International Partnership
The New York Center for Research, Economic Advancement, Science, Technology and Engineering (NY CREATES) and the Korea Institute of Advancement of Technology (KIAT) recently signed a Joint Declaration to promote collaboration and partnership between the two organizations in the field of technological innovation, with a primary focus on semiconductors.
Purdue Signs Landmark U.S.-Japan Agreement in Semiconductors at G7 Summit
On Sunday (May 21) in Hiroshima, Japan, Purdue President Mung Chiang signed another landmark international agreement, partnering with Micron, Tokyo Electron and other educational institutions in the United States and Japan to establish the “UPWARDS Network” for workforce advancement and research and development in semiconductors.
Applied Materials Launches Multibillion-Dollar R&D Platform
Applied Materials, Inc. today announced a landmark investment to build the world’s largest and most advanced facility for collaborative semiconductor process technology and manufacturing equipment research and development (R&D).
Micron Launches U.S.-Japan University Partnership
Eleven-university strong network to grow the next-generation workforce and advance semiconductor-based research in both countries.
The COMSOL Conference Returns to Munich in 2023
The COMSOL Conference is returning in person this year in Munich, Germany, on October 25–27.
FormFactor Named One of The Best Suppliers in the Semiconductor Industry for Tenth Consecutive Year
FormFactor, Inc., a semiconductor test and measurement supplier, announced that it has again been named a top performer in TechInsights’ customer satisfaction survey earning five stars in three categories.
NS Nanotech Reports World-Record Performance of Red NanoLED
Submicron-scale light-emitting diode (LED) is efficient enough for commercial microdisplay applications.
Efabless Announces AI Generated Open-Source Silicon Design Challenge
Efabless Corporation today announced its AI Generated Open-Source Silicon Design Challenge which provides a hands-on opportunity to experience how simple it can be to use AI to create and tapeout chip designs in days or even hours.
Update: China May Win in AI Computing
Leveraging hybrid bonding as an alternative to dimensional scaling.
