The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer welcoming the selection of the board of trustees of the National Semiconductor Technology Center (NSTC).
Focus on Perovskite Emitters in Blue Light-Emitting Diodes
PeLEDs have become one of the most promising next-generation display technologies.
Achronix Announces FPGA-Powered Accelerated Automatic Speech Recognition Solution
Achronix Semiconductor Corporation announced its latest innovation in partnership with Myrtle.ai — an accelerated automatic speech recognition (ASR) solution based on the Speedster7t FPGA.
BOS and Tenstorrent Partner to Develop Automotive Semiconductor
BOS Semiconductors, a South Korean automotive semiconductor startup, announced that it is partnering with Tenstorrent, an AI semiconductor company based in North America, to develop automotive SoC(System-on-chip) semiconductors for automobile and automobile part manufacturers.
Momenta Invests in Minds.ai to Accelerate the Transformation of Semiconductor Manufacturing
Minds.ai, a company applying AI to semiconductor manufacturing optimization and autonomy, has secured a significant investment from Momenta.
Micron Delivers High-Speed 7,200MT/s DDR5 Memory Using 1β Technology
Micron Technology, Inc. today announced it has extended its industry-leading 1β (1-beta) process node technology with the introduction of 16Gb DDR5 memory.
Semiconductor Industry Veteran Jim Anderson Joins Lumotive’s Board
Optical semiconductor pioneer Lumotive today announced that industry veteran Jim Anderson, President and CEO of Lattice Semiconductor, has joined the company’s board of directors.
Magnachip Unveils New 8th-Generation 150V MXT MV MOSFETs
Magnachip Semiconductor Corporation announced today the launch of two new 150V MXT MV Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs), using its 8th-generation trench MOSFET technology.
JEDEC and Open Compute Project Foundation Pave the Way for a New Era of Chiplet Innovation
In an extraordinary leap forward for the chiplet industry, the groundbreaking collaboration between the Open Compute Project Foundation (OCP) and JEDEC is set to usher in a new era of innovation.
Revasum, Inc. and Saint-Gobain Surface Solutions (SGSS) Join Forces to Innovate Silicon Carbide Wafer Grinding Technology
Revasum, Inc., a provider of advanced semiconductor manufacturing equipment, announced a strategic partnership with SGSS.
