Market forecasts, insights into the latest semiconductor materials developments, and the key role of materials in sustainability will take the spotlight at SMC (Strategic Materials Conference) Korea 2023 tomorrow at the Suwon Convention Center in Suwon-si, Gyeonggi-do, South Korea.
Semiconductor Manufacturing Monitor Points to Moderating Industry Contraction in Q2 2023, SEMI Reports
The current global semiconductor manufacturing industry contraction is expected to moderate in the second quarter of 2023 and give way to a gradual recovery starting in the third quarter.
Final Call: Applications for the 2nd Tech Innovation Excellence Award (TIE Award)
The deadline for applications for the 2nd Tech Innovation Excellence Award (TIE Award) is approaching.
NXP and TSMC to Deliver Industry’s First Automotive 16nm FinFET Embedded MRAM
NXP Semiconductors today announced its collaboration with TSMC to deliver the industry’s first automotive embedded MRAM in 16nm FinFET technology.
GlobalFoundries, Samsung Electronics, and TSMC Join Imec’s “Sustainable Semiconductor Technologies & Systems” (SSTS) Program
In response to mounting concerns about climate change, tech companies around the world are accelerating the efforts to complete carbon neutrality for their supply chains and products.
Enablence Technologies Ramps Capacity at Fremont Fab
Enablence Technologies Inc. and Noel Technologies announced today a strategic partnership designed to substantially ramp production of Enablence’s planar lightwave products at its Fremont, California wafer fab.
Intel Surpasses First 2030 Goal: $2 Billion in Diverse Supplier Spending
Early success boosts Intel’s commitment to strengthening supplier diversity in the semiconductor ecosystem.
Littelfuse Appoints Dr. Greg Henderson to Board of Directors
Littelfuse, Inc. announced today the appointment of Dr. Greg Henderson to the company’s board of directors, effective May 15, 2023.
Advanced Semiconductor Packaging Technologies: The Development Trend and the Growth Drivers, IDTechEx Reports
Advanced semiconductor packaging technologies are crucial due to the slowing of Moore’s law and rising costs of monolithic Si IC development and manufacturing.
SEMI FlexTech Invites Proposals for Flexible Hybrid Electronics Innovations
Selected projects will receive cash awards ranging from $250,000 to $1 million. The program is funded by the Army Research Laboratory (ARL).
