Infinera announced up to $93 million in federal funding to expand operations, including in the Lehigh Valley.
GlobalFoundries Announces New York Advanced Packaging and Photonics Center
First of-its-kind center will offer advanced packaging and test capabilities in New York for U.S.-made essential chips used in AI, automotive, aerospace and defense, and other applications.
Department of Commerce Finalizes Long-Term Partnership with Natcast to Operate the National Semiconductor Technology Center
CHIPS for America award will support critical research and development to drive U.S. leadership in semiconductor innovation, economic growth, and national security.
Department of Commerce Announces Direct Funding with Lehigh Valley, PA-Based Coherent Corp
The $79 million proposed chip investment will advance key semiconductor technologies capabilities to support U.S. economic and national security.
NXP Secures €1 Billion EIB Loan to Advance Semiconductor Innovation in Europe
NXP Semiconductors N.V. today announced that it has secured a €1 billion loan from the European Investment Bank (EIB) to advance the company’s RDI investments across its broad portfolio of semiconductor solutions.
Department of Commerce Announces Preliminary Terms with Analog Devices, Coherent Corp., Intelligent Epitaxy Technology, Inc. and Sumika Semiconductor Materials Texas Inc.
Proposed CHIPS investments in Massachusetts, Oregon, Washington, Pennsylvania, and Texas, would advance key semiconductor technologies capabilities to support U.S. economic and national security.
Alchip Opens 3DIC ASIC Design Services
Alchip Technologies, Limited, the high-performance ASIC leader, has formally opened its three-dimensional integrated circuit (3DIC) design services for the latest high-performance ASICs targeting AI and high-performance computing (HPC) applications.
U.S. Department of Commerce Announces $1.4 Billion in Final Awards to Support the Next Generation of U.S. Semiconductor Advanced Packaging
Today, the U.S. Department of Commerce has announced that CHIPS National Advanced Packaging Manufacturing Program (NAPMP) has finalized $1.4 billion in award funding to bolster U.S. leadership in advanced packaging and enable new technologies to be validated and transitioned at scale to U.S. manufacturing.
onsemi Completes Acquisition of Qorvo’s Silicon Carbide JFET Technology Portfolio
onsemi today announced that it has completed its acquisition of the Silicon Carbide Junction Field-Effect Transistor (SiC JFET) technology business, including the United Silicon Carbide subsidiary, from Qorvo for $115 million in cash.
SiTime Precision Timing Enables New Architectures for More Efficient AI Datacenters
SiTime Corporation, the precision timing company, today announced the differential-ended SiT5977 Super-TCXO, the newest member of the SiTime Elite RF family.
