Silicon Labs today announced the award of a $23 million grant from the Texas Semiconductor Innovation Fund (TSIF) established by the Texas CHIPS Act.
Arteris Revolutionizes Semiconductor Design with FlexGen
Arteris, Inc., a provider of system IP which accelerates system-on-chip (SoC) creation, today introduced FlexGen, a revolutionary, smart network-on-chip (NoC) interconnect IP.
eBeam Initiative Member Companies to Take Center Stage at SPIE Advanced Lithography and Patterning Conference
Member participation includes eight keynotes and nearly 300 presentations; live member event to provide insight on lithography and photomask trends.
Global Semiconductor Manufacturing Industry Reports Solid Q4 2024 Results, SEMI Reports
The global semiconductor manufacturing industry closed 2024 with strong fourth quarter results and solid year-on-year (YoY) growth across most of the key industry segments.
Applied Materials Accelerates Chip Defect Review with Next-Gen eBeam System
Applied Materials, Inc. today introduced a new defect review system to help leading semiconductor manufacturers continue pushing the limits of chip scaling.
Lam Research Ushers in New Era of Semiconductor Metallization with ALTUS Halo for Molybdenum Atomic Layer Deposition
Lam Research Corp. today unveiled ALTUS Halo, the world’s first atomic layer deposition (ALD) tool that harnesses the capabilities of the metal molybdenum in the production of leading-edge semiconductors.
Lam Research Unveils Industry’s Most Advanced Conductor Etch Technology to Date
Lam Research Corp. today introduced Akara, a breakthrough innovation in plasma etch and the most advanced conductor etch tool available.
Cambridge GaN Devices Secures $32M to Drive Global Growth in Power Semiconductor Industry
Cambridge GaN Devices has successfully closed a $32 million Series C funding round.
EV Group Highlights Revolutionary Temporary Wafer Bonding and Debonding Solution for HBM and 3D DRAM at SEMICON Korea
EV Group today announced that it is highlighting its IR LayerRelease temporary bonding and debonding (TB/DB) solution, as well other wafer bonding and lithography technologies, at the SEMICON Korea 2025 expo in Seoul, Korea on February 19-21.
Irresistible Materials Names Dinesh Bettadapur CEO
Bettadapur to drive the commercialization and market adoption of company’s innovative EUV photoresist platform.
