FormFactor, Inc., a supplier of electrical test and measurement solutions for the semiconductor industry, announced today that it has been recognized as an outstanding partner by SK hynix, a global leader in DRAM and Flash memory manufacturing.
TechSearch International Analyzes Hybrid Bonding Developments and Panel Market Growth
In its latest Advanced Packaging Update, TechSearch International provides an update on developments in hybrid bonding including applications, technical challenges, and proposed solutions. The report focuses on hybrid bonding for high-performance applications.
AlixLabs Awarded 345,000€ Swedish Innovation Agency Grant
Funds awarded from Swedish innovation agency’s “Acceleration of deep tech companies 2024” call.
SEMI Europe Recognizes Schneider Electric as a Leader in Diversity and Inclusion at SEMICON Europa 2024
SEMI Europe and the SEMI European Advisory Council for Diversity and Inclusion announced Schneider Electric as the recipient of the 2023 SEMI Industry Leader in Diversity and Inclusion Award.
xMEMS Active Micro-Cooling “Fan on a Chip” Named as CES Innovation Awards 2025 Honoree
The recently announced xMEMS XMC-2400 µCooling chip, the first-ever all-silicon, active micro-cooling air pump for small, thin electronics devices and next-generation artificial intelligence (AI) solutions, has been named a CES Innovation Awards 2025 Honoree in the best in computer hardware and components category.
TANAKA Successfully Develops the World’s First Manufacturing Technology for Platinum Materials with Nano-Sized Crystal Grains
TANAKA Kikinzoku Kogyo K.K., which develops industrial precious metal products as one of the core companies of TANAKA Precious Metals, announced that it has succeeded in developing the world’s first bulk platinum with controlled crystal grain size in the nano scale.
NVIDIA’s AI-Driven Triumph Over Intel Powered by Strategic Innovations, GlobalData Reveals
In a historic shift, NVIDIA has taken Intel’s coveted spot on the Dow Jones Industrial Average.
Biden-Harris Administration Announces CHIPS Incentives Award with TSMC Arizona
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce awarded TSMC Arizona Corporation, a subsidiary of TSMC), up to $6.6 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Pure Wafer Acquired by Private Equity Group, ZMC
With the acquisition by ZMC, Pure Wafer will undertake a new growth phase with substantial investments in fab capacity expansion across its U.S. wafer fab operations.
Pivotal Systems Opens New Manufacturing Facility in Malaysia to Meet Growing Demand for Gas Flow Solutions
Pivotal Systems Corporation has officially announced the opening of a new high volume manufacturing facility in Malaysia.
