A global review of advancements in integrating metasurfaces – thin planar arrays of nanostructures – into optoelectronic devices highlights their potential to transform technologies such as Light Emitting Diodes (LEDs), lasers, optical modulators, and photodetectors.
HKU Engineering Researchers Develop Revolutionary Diamond Fabrication Technology
A research team led by Professor Zhiqin Chu, Associate Professor in the Department of Electrical & Electronic Engineering, and Professor Yuan Lin, Professor in the Department of Mechanical Engineering, Faculty of Engineering at the University of Hong Kong (HKU), has developed a groundbreaking method for massively producing ultrathin and ultra-flexible diamond membranes.
Micon Global and Silvaco Announce New Partnership
Micon Global announced a strategic sales partnership with Silvaco, a provider of software solutions for semiconductor and photonics design, including TCAD, EDA software, and SIP solutions.
Biden-Harris Administration Announces CHIPS Incentives Awards with GlobalWafers
The Biden-Harris Administration announced that the U.S. Department of Commerce issued direct funding awards to GlobalWafers America, LLC (GWA) and MEMC LLC (MEMC), subsidiaries of GlobalWafers Co.
Smartkem Receives £900,000 Grant from Innovate UK for Advanced MicroLED Displays
Smartkem has received and accepted a £900,000 (USD 1.1 million) grant from Innovate UK for its previously announced project partnership with AUO to develop a rollable, transparent microLED display.
Rapidus Begins Installation of Japan’s First EUV Lithography Machinery
This is a significant milestone for Japan’s semiconductor industry, marking the first time that an EUV lithography tool will be used for mass production in the country.
PlayNitride Selects Veeco’s Lumina MOCVD System for MicroLED Production
Veeco Instruments Inc. today announced that PlayNitride has qualified Veeco’s Lumina MOCVD system for production of next-generation MicroLEDs, and also placed an order for two systems for delivery in 2025.
Launch of TRENG-PLP Coater: Panel Level Coater for Advanced Semiconductor Packaging
Toray Engineering Co., Ltd. has developed the TRENG-PLP Coater, a high-accuracy coating device for panel level packaging; PLP is an advanced semiconductor packaging technology.
The Rigaku Group’s XwinSys Changes its Name to Rigaku Semiconductor Instruments
To strengthen its manufacturing of equipment for advanced semiconductor packaging.
SEMICON Korea 2025 to Spotlight Edge Technologies Shaping the AI Era
SEMICON Korea 2025 will take place Feb. 19-21 in Seoul at the COEX offering a comprehensive look into AI-driven technological advancements and edge technologies poised to shape the future of the global semiconductor industry.
