Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

SEMI NBMC Invites Proposals for Wearable Sensor Innovations

The Nano-Bio Materials Consortium (NBMC), a SEMI Technology Community, today issued a Request for Proposals (RFP) aimed at advancing human performance through innovations in wearable transdermal, subcutaneous, and textile-based sensor technologies. Selected projects will receive cash awards ranging from $500,000 to $1 million.

ESD Alliance Elects 10-Member Governing Council to 2-Year Term

The Electronic System Design (ESD) Alliance, a SEMI Technology Community, today announced the election of its Governing Council for the 2023-2025 term.

GlobalFoundries Announces New General Manager to Lead Malta Manufacturing Site

GlobalFoundries (Nasdaq: GFS) (GF) today announced the appointment of Hui Peng Koh as vice president and general manager of the company’s semiconductor manufacturing facility in Malta, New York.

University of Southern California Launches $1B-Plus Initiative for Computing Including AI, Advanced Computation and Quantum Computing

USC President Carol L. Folt on Thursday announced a $1 billion-plus initiative for computing research and education across disciplines, with a focus on AI, machine learning and data science, augmented and virtual reality, robotics, gaming and block chain. 

InPlay Unveils World’s Smallest Bluetooth SoC in WLCSP Package

The new package, measuring an ultra-small 1.1mm x 2.0mm x 0.35mm, sets the record as the world’s smallest Bluetooth System on a Chip (SoC).

Keysight Joins TSMC Open Innovation Platform 3DFabric Alliance

Keysight Technologies, Inc. (NYSE: KEYS) has joined the TSMC Open Innovation Platform (OIP) 3DFabric Alliance, which was formed recently by TSMC to accelerate 3D integrated circuit (IC) ecosystem innovation and readiness.

Robert Aslett Named Si2 President and CEO

Silicon Integration Initiative today announced that it appointed Robert Aslett as president and chief executive officer.

IDTechEx Unravels Competing In-Mold Electronics Manufacturing Methodologies

Smooth, functional surfaces that provide touch sensing, often with backlighting, are becoming increasingly common.

Global Semiconductor Sales Decrease 8.7% in First Quarter

The Semiconductor Industry Association (SIA) today announced worldwide sales of semiconductors totaled $119.5 billion during the first quarter of 2023, a decrease of 8.7% compared to the fourth quarter of 2022 and 21.3% less than the first quarter of 2022.

Leti Innovation Days Will Explore Microelectronics’ Role In Enabling Transformational Technologies on June 27-29

CEA-Leti research engineers, top executives at leading global companies and entrepreneurs will share insights about technological challenges and opportunities facing industry, government and society in coming years at Leti Innovations Days, June 27-29 in Grenoble, France.