LDM3D is industry’s first generative AI model to deliver depth mapping. It has the potential to revolutionize content creation, metaverse and digital experiences.
Purdue, TSMC Extend Partnership on Semiconductor Research and Workforce Development
Semiconductor contract manufacturer stands as latest industry leader to join university’s global partnerships.
Micron Announces New Semiconductor Assembly and Test Facility in India
New DRAM and NAND assembly and test facility – the first in India – will expand Micron’s global manufacturing base to meet future demand.
Applied Materials to Establish Collaborative Engineering Center in India
Applied Materials, Inc. today announced its intention to build a collaborative engineering center in Bangalore, India focused on development and commercialization of technologies for semiconductor manufacturing equipment.
Micron UFS 4.0 Mobile Storage Built on 232-Layer 3D NAND Delivers Industry’s Fastest Performance for Smartphones
Micron Technology, Inc. announced today that it is now delivering qualification samples of its Universal Flash Storage (UFS) 4.0 mobile solution, built on its advanced 232-layer 3D NAND.
AI Advancements Propel NVIDIA to Elite Trillion-Dollar Club, Says GlobalData
Riding on the growing demand for generative artificial intelligence (AI) tools, US-based semiconductor giant Nvidia had briefly vaulted past the $1 trillion market capitalization mark.
Advantest, NXP and Arizona State University Collaborate to Launch New Test Engineering Curriculum
Advantest Corporation and Arizona State University today announced their collaboration with global semiconductor company NXP Semiconductors to create a new, “first-of-its-kind” test engineering course at ASU.
AMD Announces Plan to Invest $135 Million to Expand Adaptive Computing Research, Development and Engineering Operations in Ireland
AMD today announced plans for continued growth in Ireland through an investment of up to $135 million over four years.
Finwave Semiconductor Appoints Dr. Pierre-Yves Lesaicherre as New CEO
Finwave Semiconductor, Inc. today announced that Dr. Pierre-Yves Lesaicherre has joined the company as its chief executive officer.
Technical University of Denmark Installs New Takano Wafer Particle Measurement System from ClassOne Equipment
ClassOne Equipment announced the sale of its advanced new Takano WM-7SR particle measurement system to the DTU Nanolab at the Technical University of Denmark.
