Sourceability, a global distributor of electronic components, today announced the launch of its Excess Inventory Estimator.
Lam Research Introduces World’s First Bevel Deposition Solution to Increase Yield in Chip Production
Lam Research Corp. today introduced Coronus DX, the industry’s first bevel deposition solution optimized to address key manufacturing challenges in next-generation logic, 3D NAND and advanced packaging applications.
Airbus and STMicroelectronics Collaborate on Power Electronics for Aircraft Electrification
Airbus and STMicroelectronics have signed an agreement to cooperate on power electronics Research & Development to support more efficient and lighter power electronics, essential for future hybrid-powered aircraft and full-electric urban air vehicles.
Applied Materials Charts Progress Towards Environmental, Social and Governance Goals in Latest Sustainability Report
Applied Materials, Inc. today announced the publication of its latest Sustainability Report, detailing its ESG (environmental, social and governance) initiatives and results over the past year.
ITRI Set to Strengthen Taiwan-UK Collaboration on Semiconductors
The newly established Department for Science, Innovation and Technology (DSIT) in the UK has recently released the UK’s National Semiconductor Strategy.
Intel, German Government Agree on Increased Scope for Wafer Fabrication Site in Magdeburg
Intel and the German federal government have signed a revised letter of intent for Intel’s planned leading-edge wafer fabrication site in Magdeburg, the capital of Saxony-Anhalt state in Germany.
OMNIVISION Adds Two New Products to Its Broad Family of Global Shutter Sensors
OMNIVISION today announced two new additions to its Nyxel near-infrared (NIR) technology family.
RED Semiconductor Adds David Harold to Management Team
RED Semiconductor, a fabless semiconductor company, has added David Harold to the management team as Head of Business Development.
Vitesco Technologies and ROHM Sign a Long-Term SiC Supply Partnership
Vitesco Technologies, an international manufacturer of modern drive technologies and electrification solutions, has secured strategically important capacities in energy-efficient silicon carbide power semiconductors through a long-term supply partnership with ROHM – worth over one billion US dollars until 2030.
Extending Moore’s Law: CEA-Leti & Intel to Develop Atomically Thin 2D TMDs on 300mm Wafers Using Layer Transfer Technology for Future Transistor Scaling
CEA-Leti and Intel today announced a joint research project to develop layer transfer technology of two-dimensional transition-metal dichalcogenides (2D TMDs) on 300mm wafers with the goal to extend Moore’s Law beyond 2030.
