GlobalFoundries today sued IBM for trade secret misappropriation.
Purdue Convenes CHIPS Summit in D.C. With Sec. Raimondo and Sen. Young
Leaders from industry, government and academia convened at a summit Tuesday (April 18) in Washington, D.C. to forge national solutions at scale to address the future of U.S. innovation in microelectronics and the semiconductor workforce.
SIA Applauds House Introduction of Bipartisan Legislation to Restore Immediate Deductibility of R&D Investments
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer commending the introduction in the House of Representatives of bipartisan legislation to restore full tax deductibility of R&D investments.
Chemists Propose Ultrathin Material for Doubling Solar Cell Efficiency
CSU chemists are proposing to make solar cells using not silicon, but an abundantly available natural material called molybdenum disulfide.
Noel Technologies Ramps Capacity at Silicon Valley Fab
Noel Technologies, a Pure Wafer company, announced today a major expansion at its Campbell, California wafer fab.
xMEMS Announces General Availability of the World’s Only All-Silicon, Solid-State Fidelity Micro Speakers
xMEMS Labs today announced general availability of three revolutionary solutions for immediate integration into next-generation true wireless (TWS) earphones, in-ear-monitors (IEMs), digital hearing aids, and other emerging personal audio electronics, including smart glasses and sleep buds.
Cellcom Telecommunications Israel Plans to Roll Out Independent 5G Network
Cellcom Telecommunications Israel and Parallel Wireless Inc are launching a unique, first-of-its-kind experiment to deploy a standalone 5th generation (5G SA) network for autonomous 5G.
SMC Korea 2023 to Showcase Future of Semiconductor Materials
With Korea a major consumer of semiconductor materials and advanced materials a key driver of innovation, the stage is set for SMC (Strategic Materials Conference) Korea 2023 on May 17, 2023 at the Suwon Convention Center in Seoul, South Korea as industry leaders and experts gather to provide market forecasts and insights into the latest materials developments and trends.
KAIST Team Develops Highly-Sensitive Wearable Piezoelectric Blood Pressure Sensor
A KAIST research team led by Professor Keon Jae Lee from the Department of Materials Science and Engineering and the College of Medicine of the Catholic University of Korea has developed a highly sensitive, wearable piezoelectric blood pressure sensor.
Cadence Extends Collaboration with TSMC and Microsoft
Cadence Design Systems, Inc. announced today an expanded collaboration with TSMC and Microsoft, focusing on accelerating the physical verification of giga-scale digital designs.
