Worldwide sales of semiconductor manufacturing equipment increased 5% from $102.6 billion in 2021 to an all-time record of $107.6 billion last year.
ZF Signs Multi-Year Supply Agreement with STMicroelectronics for Silicon Carbide Devices
The technology group ZF will, from 2025, purchase silicon carbide devices from STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications.
EnCharge AI Appoints Industry Leader Ram Rangarajan as Senior Vice President, Product and Strategy
EnCharge AI, the company developing advanced AI accelerators for deployments across Edge-Cloud, today announced Ram Rangarajan as its Senior Vice President, Product and Strategy.
CEA-Leti to Report Progress on 3D Interconnects for Wafer-Level Platforms At Electronic Components and Technology Conference, May 30-June 2
CEA-Leti will present seven papers on 3D interconnects focused primarily on semiconductor wafer-level platforms at the Electronic Components and Technology Conference (ECTC), May 30-June 2, in Orlando, Fla.
Synopsys Introduces the Industry’s First Emulation System with Unmatched Capacity to Enable Electronics Digital Twins of Advanced SoCs
Addressing the software bring-up, power optimization and debug challenges of complex billion-gate and multi-die systems, Synopsys, Inc. today launched the Synopsys ZeBu Server 5 emulation system.
SiTime Delivers Precision Timing Solution for Industry Leading Low Power FPGAs from Lattice Semiconductor
The SiTime devices, a Cascade MEMS-based Clock-System-on-a-Chip (ClkSoC) and an Emerald OCXO or Elite X Super-TCXO, are incorporated into Lattice’s new synchronization hardware development platform.
JEDEC Expands CAMM Standardization to Include Two Key Memory Technologies
JEDEC Solid State Technology Association today announced an expansion of its CAMM standardization activity to include stackable CAMMs and support of LPDDR5.
Intel Foundry and Arm Announce Multigeneration Collaboration on Leading-Edge SoC Design
Intel Foundry Services (IFS) and Arm today announced a multigeneration agreement to enable chip designers to build low-power compute system-on-chips (SoCs) on the Intel 18A process.
Backscattering Protection in Integrated Photonics Is Impossible With Existing Technologies
DTU researchers raise fundamental questions about the proposed value of topological protection against backscattering in integrated photonics.
3D-Micromac Shortens Atom Probe Tomography Sample Prep Time From Hours to Minutes With New Laser Micromachining System
3D-Micromac AG today introduced the microPREP PRO FEMTO laser micromachining system for high-speed Atom Probe Tomography (APT) and cross-section sample preparation.
