Program will increase the research capacity of emerging research institutions and the entire U.S. semiconductor innovation ecosystem.
JST Names Dr. Ismail Kashkoush as Chief Technology Officer
Dr. Kashkoush will lead JST’s engineering, technology, and product line teams in the development of JST’s surface preparation products and processes.
US-Manufactured Nanopositioning Stage for Super Resolution Microscopy, Material Science
PI (Physik Instrumente) offers a series of piezo-flexure controlled nanopositioning stages for high-resolution microscopy and material science applications.
James Culp of GlobalFoundries Joins Si2 Board
The Silicon Integration Initiative has announced the addition of James Culp, a GlobalFoundries corporate fellow, to its board of directors.
Biden-Harris Administration Announces NY CREATES’ Albany NanoTech Complex as the First CHIPS for America R&D Flagship Facility
Today, the Department of Commerce and Natcast, the operator of the National Semiconductor Technology Center (NSTC), announced the expected location for the first CHIPS for America research and development (R&D) flagship facility.
IBM and Albany Partners Unlock New Yield Benchmarks for EUV Patterning
Working at NY CREATES’s Albany NanoTech Complex, a team of researchers report the newest yields for Low NA and High NA EUV patterning, which shows a pathway to sub-2 nm nodes.
Spin Current Observations From Organic Semiconductor Side
Polymer’s long spin relaxation time helps researchers gain spintronic insights.
Smart Sensor Patch Detects Health Symptoms Through Edge Computing
Edge computing on a smartphone has been used to analyze data collected by a multimodal flexible wearable sensor patch and detect arrhythmia, coughs and falls.
ULVAC Launches Technology Center PYEONGTAEK for Next-Gen Semiconductor Manufacturing Equipment in South Korea
ULVAC, Inc. has established Technology Center PYEONGTAEK in Pyeongtaek, Gyeonggi-do, South Korea.
ESCATEC Pushes New Boundaries in Micro-Electronics with UV Enhanced Die Bonder Technology
Electronics Manufacturing Services (EMS) provider, ESCATEC, has successfully integrated a UV light feature to its die bonder, significantly enhancing the precision and efficiency of the micro-assembly processes.
