A new study by researchers at the University of Cambridge reveals a surprising discovery that could transform the future of electrochemical devices.
Nippon Express U.S.A. Opens Mesa Logistics Center, Dedicated Semiconductor Warehouse in Mesa, Arizona
An opening ceremony marking the occasion, held on April 24, 2023, was attended by around 45 guests.
Gelest Breaks Ground on New Production Facility
Today, Gelest, Inc., a Mitsubishi Chemical Group company, marks a new milestone with the groundbreaking of its latest production facility.
ROHM’s New RGB Chip LED for Automotive Interiors Minimizes Color Variations Due to Color Mixing
ROHM Semiconductor today announced a new RGB chip LED (SMLVN6RGBFU) ideal for automotive interiors, such as function and status indicators in instrument clusters, CID (Center Information Displays) and accent lighting for footwells and door handles.
Lavorro and BISTelligence Enter into a Strategic Product Distribution and Support Agreement
Lavorro announced its strategic Distribution and Support Agreement with BISTelligence for deploying and supporting Lavorro software products on the Semiconductor Tools and in the Fabs.
AI-Based Technique for Predicting Crystal Orientation Improves the Efficiency of Manufacturing Most Electronic Devices
A team led by Nagoya University researchers in Japan has successfully predicted crystal orientation by teaching an artificial intelligence (AI) using optical photographs of polycrystalline materials. The results were published in APL Machine Learning.
Researchers Grow Precise Arrays of NanoLEDs
A new technique produces perovskite nanocrystals right where they’re needed, so the exceedingly delicate materials can be integrated into nanoscale devices.
SkyWater CEO Thomas Sonderman to Deliver Keynote at SEMICON West
SkyWater Technology today announced its President and CEO, Thomas Sonderman will provide a keynote at SEMICON West 2023 on July 13th.
Transphorm Confirms Gallium Nitride Materials Sources Are Secure
Transphorm, Inc. today responded to the recent news regarding China export restrictions.
REVASUM Announces the Release of 200mm Conversion Kit for 6EZ SiC CMP platform
Revasum today announced the availability of 200mm SiC wafer polishing capability on the 6EZ platform.
