CEA-Leti research engineers have demonstrated for the first time a scalable hafnia-zirconia-based ferroelectric capacitor platform integrated into the back-end-of-line (BEOL) at the 22nm FD-SOI technology node.
SIA Applauds Announcement of CHIPS Act Incentives for Micron Projects
The Semiconductor Industry Association applauded the U.S. Department of Commerce and Micron for finalizing semiconductor manufacturing incentives for new projects in Boise, Idaho and Clay, New York, as well as announcing new incentives for Micron’s planned expansion in Manassas, Virginia.
Lam Research Introduces the Semiconductor Industry’s First Collaborative Robot for Fab Maintenance Optimization
Dextro’s robotic arm delivers precision and accuracy to help chipmakers drive yield improvement.
xMEMS Labs Announces the First Public Demos of its Sycamore MEMS Loud Speaker and Micro-Cooling Fan-on-a-Chip Solutions at CES 2025
xMEMS Labs today announced that CES 2025 will be the first public demonstrations of its latest MEMS innovations – the xMEMS Sycamore loud speaker and µCooling fan-on-a-chip (January 7-10, Venetian Hotel Suite 29-235).
Advantest Launches KGD Test Cell for Power Semiconductors
Semiconductor test equipment supplier Advantest Corporation today announced an integrated test cell designed to maximize die-level test yields for wide-bandgap (WBG) devices essential to power semiconductors.
Researchers Design New Materials for Advanced Chip Manufacturing
Three University of Texas at Dallas faculty members and collaborators from other universities and two industry partners have teamed up to design and test indium-based materials to enable the manufacture of the next generation of computer chips.
Faster Organic Phosphorescence for Better Display Tech
Layering an organic material on top of 2D materials achieves stable, fast phosphorescent light emission without using expensive and hazardous heavy metals.
NY CREATES and JETRO Announce Strategic Partnership to Strengthen U.S.-Japan Collaboration in the Semiconductor Industry
NY CREATES and the Japan External Trade Organization (JETRO) today announced a strategic partnership to drive international collaboration in the semiconductor industry, highlighting a commitment to promoting advanced chips-related research and development, technology alliances, and workforce development across the high-tech ecosystems of New York’s Capital Region and Japan.
Global Total Semiconductor Equipment Sales Forecast to Reach a Record of $139 Billion in 2026, SEMI Reports
Global sales of total semiconductor manufacturing equipment by original equipment manufacturers (OEMs) are forecast to set a new industry record, reaching $113 billion in 2024, growing 6.5% year-on-year, SEMI announced today.
Bismuth Telluride-Based Thermoelectrics for Chip-Scale Refrigeration
Professor Jing-Feng Li’s group at Tsinghua University has published a research article in the National Science Review, where a novel microstructure modulation strategy is proposed for Bi2Te3 alloy to effectively enhance both the mechanical and TE performance.
