Boston Semi Equipment today announced its test handler backlog has reached a historical level and continues to grow.
Pusan National University Researchers Develop Novel Stackable Hole Injection Layer Material for Solution-processed OLEDs
Researchers have now developed a novel thermally cross-linkable poly(iminoarylene), a solvent-resistant hole injection layer material with excellent film-forming properties, optimum energy level and high mobility, a major stepping stone toward commercial viability of solution-processed OLEDs.
Henkel Delivers Versatile, High Thermal Die Attach Adhesive for Power IC Applications
Henkel today announced the availability of a die attach adhesive that provides high thermal capability to enable superior operation of power semiconductor packages.
New AI Model Transforms Understanding of Metal-Organic Frameworks
Researchers at EPFL and KAIST have created a transformer for Metal-Organic Frameworks (MOFs), a class of porous crystalline materials. By combining organic linkers with metal nodes, chemists can synthesize millions of different materials with potential applications in energy storage and gas separation.
IMAPS Advanced System-in-Package Conference is Now CHIPcon
The top global event for advanced Chiplet and Heterogeneous Integration Packaging (CHIP) technologies to be held in July 2023.
Intrinsic Semiconductor Technologies Secures $8.5M Investment to Solve the Memory Bottleneck for Data Hungry Applications
Innovative non-volatile memory technology from UCL spin-out will create a new generation of small devices with big brains that embed intelligence everywhere.
Micron Releases ‘We Are Micron’ 2022 Diversity, Equality and Inclusion Report
Initiatives creating readiness for the workforce of the future and highlighting ongoing commitment to diversity.
Electric Vehicle Components Market Is Estimated To Be Valued At US$ 1001.95 Billion By 2032
The market is further expected to gain size of USD 1001.95 Billion by the year 2032. The market is expected to grow with a CAGR of 21.05% in the forecast period.
Tower Semiconductor Announces World’s First Heterogeneous Integration of Quantum Dot Lasers on its Popular SiPho Foundry Platform PH18
Tower Semiconductor, a foundry of high-value analog semiconductor solutions, in collaboration with Quintessent, Inc, today announced the world’s first heterogeneous integration of GaAs quantum dot (QD) lasers and a foundry silicon photonics platform (PH18DB).
Tower Semiconductor and Teramount Announce Technology Collaboration Connecting a Large Number of Optical Fibers to Silicon Chips
Tower Semiconductor, a foundry of high value analog semiconductor solutions, and Teramount today announced a collaboration based on Teramount’s ‘PhotonicPlug’ technology and Tower’s silicon photonic ‘Bump-ready’ wafers.‘
