Mr. Moorby honored during DVCon U.S. 2023 for inventing Verilog HDL.
TUS Researchers Propose a Simple, Inexpensive Approach to Fabricating Carbon Nanotube Wiring on Plastic Films
The proposed method produces wiring suitable for developing all-carbon devices, including flexible sensors and energy conversion and storage devices.
JCET Provides Multiple Customers with Advanced Packaging HVM Solutions for 4D Millimeter-wave Radar
JCET Group recently announced the company provides multiple customers with advanced packaging HVM solutions for 4D millimeter-wave Radar, to meet the increasingly diversified and customized demands of automotive electronic applications.
SweGaN Launches Project for New Headquarters and Wafer Production Facility
The new facility will be built at the Innovative Materials Arena (IMA). IMA is cluster for innovative materials located in Linköping, Sweden, in Östergötland – a region renowned for its progressive materials industries.
2023 CMC Conference Announces Lineup of Speakers
Featuring talks on current trends, issues, and new technologies for the semiconductor materials supply chain.
KULR Secures Follow-on $2.68M Contract
After extensive design and testing efforts, this order represents KULR’s single largest PPR deployment order in a stationary or mobile energy product to date.
imec’s Virtual Fab Underpins Strategies to Reduce the Carbon Footprint of Lithography and Etch Process Steps
This week, at the 2023 Advanced Lithography + Patterning Conference, imec presents a quantitative assessment of the environmental impact of patterning in advanced IC manufacturing.
EUV Tech and IBM Join the eBeam Initiative
The eBeam Initiative, a forum dedicated to the education and promotion of new semiconductor manufacturing approaches based on electron beam (eBeam) technologies, today announces the addition of two new company members to the organization.
MITRE Engenuity and Semiconductor Alliance Position Paper Outlines Guidance for National Semiconductor Technology Center Incubation
Ensuring the United States improves its global competitiveness in semiconductors requires strategic deployment of the $52.7 billion in funding authorized in the CHIPS + Science Act.
Arteris and SiFive Partner to Accelerate RISC-V SoC Design of Edge AI Applications
Arteris, Inc. and SiFive, Inc. today announced their partnership to help speed up Edge AI electronic product innovation for consumer electronics and industrial applications.
