At the end of 2022, Samsung, Micron, and SK Hynix accounted for 76% of leading-edge capacity, with the vast majority of it for advanced DRAM and 3D NAND production.
Semiconductor Wet Chemicals 1H2023 Trending Down
Although 200+ new layer chip offerings are expected in 2023.
Applied Materials’ Pattern-Shaping Technology Reduces the Cost, Complexity and Environmental Impact of Advanced Chip Manufacturing
Applied Materials, Inc. today unveiled a breakthrough in patterning technology that allows chipmakers to create high-performance transistors and interconnect wiring with fewer EUV lithography steps, thereby lowering the cost, complexity and environmental impact of advanced chipmaking.
Infinitesima Announces First Customer Shipment of Metron3D In-Line Probe Metrology System
Infinitesima have completed the first customer shipment of the Metron3D metrology system, a revolutionary sub-nanometer, high speed 3D imaging system that operates at in-line production throughputs.
Applied Materials’ New eBeam Metrology System Paves the Way to High-NA EUV Lithography
Applied Materials, Inc. today introduced a new eBeam metrology system specifically designed to precisely measure the critical dimensions of semiconductor device features patterned with EUV and emerging High-NA EUV lithography.
ACM Research Receives Purchase Order for SAPS Tool from Major European Global Semiconductor Manufacturer
The tool is expected to be shipped to the prospective customer’s European facility in the fourth quarter of 2023.
Intel Showcases New 5G Products at MWC 2023
Today, Intel announced a range of products and solutions driving this transition and broad industry support from leading operators, original equipment manufacturers (OEMs) and independent software vendors (ISVs).
Tiny New Climbing Robot Was Inspired by Geckos and Inchworms
The untethered soft robot could one day help doctors perform surgery.
Arctic Semiconductor and Compal Introduce World’s First Universal Small Cell Infrastructure Platform for 5G Networks
Arctic Semiconductor today announced that its groundbreaking RF transceiver, IceWings is powering a new universal 5G small cell infrastructure platform from Compal Electronics, one of the world’s largest ODMs.
imec at SPIE Advanced Lithography + Patterning 2023
This year at SPIE Advanced Lithography + Patterning, imec has a record number of 70 contributions, of which 42 first authored papers and 28 co-authored papers.
