JEDEC Solid State Technology Association today announced an expansion of its CAMM standardization activity to include stackable CAMMs and support of LPDDR5.
Intel Foundry and Arm Announce Multigeneration Collaboration on Leading-Edge SoC Design
Intel Foundry Services (IFS) and Arm today announced a multigeneration agreement to enable chip designers to build low-power compute system-on-chips (SoCs) on the Intel 18A process.
Backscattering Protection in Integrated Photonics Is Impossible With Existing Technologies
DTU researchers raise fundamental questions about the proposed value of topological protection against backscattering in integrated photonics.
3D-Micromac Shortens Atom Probe Tomography Sample Prep Time From Hours to Minutes With New Laser Micromachining System
3D-Micromac AG today introduced the microPREP PRO FEMTO laser micromachining system for high-speed Atom Probe Tomography (APT) and cross-section sample preparation.
Lightelligence Joins Global Semiconductor Alliance
Lightelligence today became a member of the Global Semiconductor Alliance (GSA), the voice of the global semiconductor industry.
New SEMI Europe-Led Consortium Wins Funding to Help Overcome Europe’s Microelectronics Industry Skills and Talent Shortage
SEMI, the industry association serving the global electronics design and manufacturing supply chain, today announced that SEMI Europe, as the lead of a new 18-partner consortium, has won up to €4 million in funding to develop the European Chips Skills Academy, an initiative to help tackle the skills and talent shortages in Europe’s electronics industry and propel its long-term growth.
Women in Semiconductors 2023 to Highlight Bridging the Gender Gap Through Allyship
The vital importance of workplace inclusion and diversity to the growth of the global semiconductor industry will take center stage as the Women in Semiconductors (WiS) program returns in-person on May 1 in conjunction with the SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2023) in Saratoga Springs, New York.
Renesas Samples Its First 22nm Microcontroller
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today announced that it has produced its first microcontroller (MCU) based on advanced 22nm process technology.
GlobalFoundries Engineer Receives $50,000 Award for Groundbreaking Technology Advances in Inaugural GFX Prize Program
Additional innovation winners announced for 2023 Master Inventors and DE&I in Inventorship Champion.
Mark Lewis Named Inaugural CEO of Purdue Applied Research Institute
Purdue University announced Tuesday (April 11) the hire of Mark Lewis as the first chief executive officer of the Purdue Applied Research Institute (PARI), the nonprofit applied research arm of Purdue with a particular focus on national security, economic security and food security for the United States.
