Critical Manufacturing is returning to SEMICON Europa 2024 to showcase its advanced Manufacturing Execution System (MES), tailored to the unique needs of the semiconductor industry.
ZEISS Launches New Crossbeam 550 Samplefab FIB-SEM
New TEM preparation platform with industry-leading automation yield.
New DUV Micro-LED Array Advances Maskless Photolithography
A team led by Prof. Sun Haiding from the University of Science and Technology of China (USTC) developed a vertically integrated micro-scale light-emitting diode (micro-LED) array, which was then applied in deep ultraviolet (DUV) maskless photolithography system for the first time.
Renesas Collaborates with Intel on Power Management Solution for New Intel Core Ultra 200V Series Processors
Renesas Electronics Corporation (TSE:6723), a supplier of advanced semiconductor solutions, today announced a collaboration with Intel resulting in a power management solution that delivers best-in-class battery efficiency for laptops based on the new Intel Core Ultra 200V series.
US CHIPS Act Set to Reshape Helium Demand in the US
Two years after signing the US Chips Act into law for onshore chip manufacturing, over US$30 billion of the total US$39 billion in direct incentives have been awarded to date.
Tech and Talent to Supercharge the Semiconductor Industry
New CHIPS and Science Act funding supports Arizona State University efforts to create an ultra-energy-efficient chip and fill microelectronics workforce shortages.
Sunlit Chemical Expands Global Reach with U.S. Facility Opening in Phoenix
The new plant, strategically located in Phoenix, Ariz., will provide critical materials to support the U.S. semiconductor industry.
Top MRAM Maker Selects ClassOne Solstice S8 Single-Wafer System for High-Volume Manufacture of Non-Volatile MRAM Devices
The customer selected the Solstice system for its ability to deliver repeatable wet processing essential to meeting high-volume manufacturing (HVM) requirements.
DELO Introduces UV-Approach for Fan-Out Wafer-Level Packaging
DELO has developed a new approach for fan-out wafer-level packaging (FOWLP).
EV Group Announces Management Board Expansion In Light Of Unabated Growth
EV Group (EVG), a provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today announced the expansion of its management board.
