Edge Impulse, the platform for building, deploying, and scaling edge machine learning models, and an ST Authorized Partner, has entered into a collaboration with ST on industry-leading solutions for practical applications of AI in edge environments.
Tachyum Expands European Hub with New Offices in Czech Republic
Tachyum today announced the opening of new positions in Brno, Czech Republic, to support the company’s continued growth as it nears tape-out of the Prodigy Universal Processor Chip.
Renesas Leads ADAS Innovation with Power-Efficient 4th-Generation R-Car Automotive SoCs
Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today expanded its popular R-Car Family of system-on-chips (SoCs) for entry-level Advanced Driver Assistance Systems (ADAS).
Samsung Electronics Develops Industry’s First Automotive SSD Based on 8th-Generation V-NAND
Samsung Electronics Co., Ltd. today announced it has successfully developed the industry’s first PCIe 4.0 automotive SSD based on eighth-generation vertical NAND (V-NAND)
New CEA-Leti Technology Improves DC-DC Converter Efficiency and Paves the Way to Piezoelectric Converters Without Transformers
Building on its earlier breakthroughs introducing a new way of converting electrical power using piezoelectric resonators and developing a dual-bridge piezoelectric resonator converter, CEA-Leti has paved the way to isolating piezoelectric converters without transformers.
Soitec and Resonac Announce the Signing of a Joint Development Agreement
Resonac Corporation and Soitec have signed an agreement to develop 200mm (8-inch) SmartSiC silicon carbide (SiC) wafers using Resonac substrates and epitaxy processes, in a major step for the deployment of Soitec’s high-yielding silicon carbide technology in Japan and other international markets.
SIA Urges House Passage of Bipartisan Bill to Streamline Environmental Review of CHIPS Projects
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer urging the House of Representatives to pass the Building Chips in America Act (S. 2228).
Jabil Expands Silicon Photonics Capabilities to Enable Next-Generation AI and Data Center Technologies
Jabil Inc. today announced its continued investment in silicon photonics-based products and capabilities to support the increasing demands of hyperscalers and next-wave cloud and AI data center growth.
HyperLight Accelerates Growth With $37M Funding Led by Summit Partners
HyperLight Corporation, a provider of thin film lithium niobate (TFLN) photonic integrated circuits (PICs), today announced a US$37 million Series B investment led by Summit Partners.
Lam Research Honors Global Suppliers with 2024 Excellence Awards
Lam Research Corp. today announced this year’s recipients of its annual Supplier Excellence Awards, recognizing nine companies from around the world for performance across a range of categories.
