An international team led by researchers from Nanyang Technological University, Singapore (NTU Singapore) has developed a universal connector to assemble stretchable devices simply and quickly, in a ‘Lego-like’ manner.
TFT Strategy to Enhance Flexible Display Panel Performance
Advances in display technologies prompt the development of electronic products with foldable and flexible panels.
JEDEC Wide Bandgap Power Semiconductor Committee Publishes a Series of Documents for Reliability and Testing of Silicon Carbide (SiC) MOSFETs
The publications were developed by JEDEC’s JC-70.2 Silicon Carbide Subcommittee and are available for free download from the JEDEC website.
Cogniteam’s Nimbus Unifies Robot and Facility Sensor Integrations, Reducing Development Time by 60%
Unifying the full layout, from robots to infrastructure sensors, companies develop emerging autonomous use cases 60% faster. “Successful robot deployments demand a single development platform for both the machine and facility integrations,” said Dr. Yehuda Elmaliah, Co-Founder & CEO of Cogniteam.
Silicon Motion Launches Third Generation PCIe Gen4 SSD Controller for Future TLC and QLC 3D NAND Flash
Silicon Motion Technology Corporationtoday announced the SM2268XT, its latest high-performance PCIe Gen4 SSD controller solution optimized for higher speed NAND transfer rates.
Arctic Semiconductor Ships Its First 5G RF Chipset, IceWings, for the 5G Market
Arctic Semiconductor today announced it has rebranded from SiTune Corporation to Arctic Semiconductor, to emphasize its focus on 5G RF products.
Telink Semiconductor Helps HooRii Technology Achieve Matter Certification for Its Smart Plug Product
Telink Semiconductor Co. today announced that it has helped HooRii Technology acquire Matter certification for its smart plug product.
Intelligent High-Side Switch from Diodes Incorporated Enables Assured Automotive System Reliability
Diodes Incorporated has introduced the DIODES ZXMS81045SPQ, its first protected, automotive-compliant, high-side IntelliFET.
Quantum Brilliance Secures $18 Million USD in Funding to Advance Miniaturized Quantum Computers
Quantum Brilliance, a developer of room-temperature miniaturized quantum computing products and solutions, today announced an $18 million USD fundraise.
Adeia and Qorvo Enter into Hybrid Bonding License Agreement
Adeia Inc., the company whose patented innovations enhance billions of devices, today announced that Qorvo, a global provider of connectivity and power solutions, has licensed Adeia’s hybrid bonding technology.
