Gigaphoton Inc., a manufacturer of lightsources for semiconductor lithography, announced that it installed its first solar panel on the roof of the head office.
Gordon Moore, Intel Co-Founder, Dies at 94
Intel and the Gordon and Betty Moore Foundation announced that company co-founder Gordon Moore died on March 24, 2023, at the age of 94.
Ruggedness of Cambridge GaN Devices’ ICeGaN Technology Proven in Virginia Tech Paper at APEC
70 V over-voltage capability combines with intelligent on-chip protection to deliver highest GaN reliability and ruggedness.
MEMS Market to Surpass US$ 48,595.4 Million by 2030, Says Coherent Market Insights
The MEMS market is estimated to be valued at US$ 23,858 million in 2021 and is expected to exhibit a CAGR of 8.23% during the forecast period (2023-2030).
FUJIFILM Electronic Materials, U.S.A., Inc. Invests in Enhanced Sustainability for its Mesa, Ariz. Campus
FUJIFILM Electronic Materials, U.S.A., Inc., announced today key sustainability initiatives designed to increase the organization’s commitment to sustainable business practices, including solar panel installation and water conservation measures.
AI “Brain” Created from Core Materials for OLED TVs
A joint research team from POSTECH develops semiconductor devices for high-performance AI operations by applying IGZO materials widely used in OLED displays.
Investment Boom in Semiconductor Industry: Exyte Expands Engineering and Production Capacities in Czech Republic
Exyte, a global leader in the design, engineering, and delivery of high-tech facilities, is expanding its engineering and production capacities in the Czech Republic.
Dell’Oro Group Launches New Data Center IT Semiconductors and Components Advanced Research Report
Dell’Oro Group announced today the launch of its new Data Center IT Semiconductors and Components advanced research report.
IDTechEx Discusses The Tantalizing Potential for GaN in Electric Vehicle Power Electronics
As electric vehicle (EV) power electronics undergoes a paradigm shift towards wide bandgap (WBG) semiconductors, it is clear that silicon carbide (SiC) is becoming the material of choice, while gallium nitride (GaN) is often shoe-boxed into telecommunications or optoelectronics applications.
Global High Bandwidth Memory Market to Hit Sales of US$ 3,433.8 Million by 2031
The global high bandwidth memory market is projected to reach US$ 3,433.8 million by 2031 up from US$ 292.7 million in 2022, at a CAGR of 31.3% during the forecast period 2023-2031.
