Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Cadence Collaborates with GUC on AI, HPC and Networking in Advanced Packaging Technologies

Cadence Design Systems, Inc. today announced that the Cadence 112G-LR SerDes is silicon proven on the HBM3/GLink/CoWoS platform from Global Unichip Corp.

Atomera Signs Commercial License Agreement with STMicroelectronics

Atomera Incorporated, a semiconductor materials and technology licensing company, today announced the execution of a commercial license agreement with STMicroelectronics (ST).

Renesas Expands Focus on India with New NB-IoT Solution

Renesas Electronics Corporation, a supplier of advanced semiconductor solutions, today introduced an NB-IoT (Narrowband Internet of Things) chipset specifically for the Indian market.

onsemi Ships One Billionth Inductive Sensor IC to HELLA

onsemi today announced that the company has shipped its one billionth Inductive Sensor Interface Integrated Circuit (IC) to HELLA, an international automotive supplier operating under the umbrella brand FORVIA.

Bosch Plans to Acquire U.S. Chipmaker TSI Semiconductors

Bosch is expanding its semiconductor business with silicon carbide chips. The technology company plans to acquire assets of the U.S. chipmaker TSI Semiconductors, based in Roseville, California.

onsemi and ZEEKR Sign Long-Term Supply Agreement for Silicon Carbide Power Devices

ZEEKR and onsemi announce long-term supply agreement for EliteSiC power devices.

Partnership for True Multiple Sourcing: ROHM IGBTs with Semikron Danfoss Power Modules

Kyoto-based ROHM Semiconductor and Semikron Danfoss have been collaborating for more than ten years with regards to the implementation of silicon carbide (SiC) inside power modules.

POLYNICES Project Launched in Europe

Polymer-based components enable low-cost photonic modules for THz sensing and quantum computing applications.

Global Top 25 Tech Companies Gain Over $2.4T in Q1 2023 Despite Challenges, Reveals GlobalData

Despite the ongoing challenges posed by geopolitical issues and interest rate hikes, the global top 25 technology companies gained more than $2.4 trillion in valuation in the first quarter (Q1) of 2023, reveals GlobalData, a data and analytics company.

Synopsys, Ansys and Keysight Collaborate with TSMC

To accelerate development of advanced radio frequency (RF) and millimeter wave (mmWave) designs with high reliability, Synopsys, Inc., Ansys and Keysight Technologies, Inc. today announced the availability of the new 79GHz millimeter wave (mmWave) radio frequency (RF) design reference flow for the TSMC 16nm FinFET Compact Technology (16FFC).