3DGaN (Gallium Nitride) innovators Finwave Semiconductor, Inc. today announced they have joined the American Semiconductor Innovation Coalition (ASIC).
Park Systems Introduces Park NX-IR R300 Infrared Spectroscopy for Semiconductor Industry
Park Systems, a manufacturer of atomic force microscopy (AFM) and nano metrology systems, has introduced its newest product, the Park NX-IR R300, a nanoscale infrared spectroscopy (IR) system for industrial applications.
Micron DDR5 Delivers Increased Performance and Reliability for the 4th Gen Intel Xeon Scalable Processor Family
Micron Technology, Inc. today announced that its DDR5 server memory portfolio for the data center is now fully validated on the 4th Gen Intel Xeon Scalable processor family.
Arteris Acquires Semifore to Accelerate System-on-Chip Development
Augmenting leading network-on-chip IP and IP deployment automation with the leading hardware/software interface automation solution.
POET Technologies Announces Production Release of Optical Engines for 100G, 200G and 400G for Telecom and Data Center Market
Achievement marks commercialization milestone for products built with proprietary wafer-level chip-scale packaging technology.
Slowing Industry Conditions Temporarily Eases Supply Strain in 2023 for Silicon and SOI Wafers
Investments in increased capacity not expected to alleviate strain until 2024-2025.
Engineers to Advance Nanomedicine Manufacturing Using AI
A novel combination of artificial intelligence and production techniques could change the future of nanomedicine, according to Cornell researchers using a new $3 million grant from the National Science Foundation to revolutionize how polymer nanoparticles are manufactured.
New NSF Center Tackling Microelectronic Chips’ Energy Efficiency
A new center is being established that will attack microprocessors’ energy efficiency problems head-on, with an ambitious goal of hundredfold reduction in energy consumption.
Saras Micro Devices Appoints Industry Leader Ron Huemoeller to CEO
The Board of Directors of Saras Micro Devices (SMD), a provider of advanced power delivery solutions for high-performance semiconductor devices, announced the appointment of Ron Huemoeller as Chief Executive Officer effective January 9, 2023.
STPOWER Automotive-Grade Devices from STMicroelectronics Run Cooler in Surface-Mount ACEPACK SMIT Package
STMicroelectronics has introduced five power-semiconductor bridges in popular configurations, housed in ST’s advanced ACEPACK SMIT package that eases assembly and enhances power density over conventional TO-style packages.
