Ambarella, Inc. (NASDAQ: AMBA), an edge AI semiconductor company, and Applied Intuition, a software solutions provider for autonomous vehicle (AV) development, today at CES 2023 announced a partnership to offer a joint ADAS and AV development solution based on Ambarella’s CV3-AD PCIe hardware-in-the-loop (HIL) card and Applied’s simulation software.
Development of Bio-Friendly Transparent Temperature Sensor Technology that Precisely Measures Temperature Changes by Light
A joint research team led by DGIST Professor Kang Hong-gi and KIST Dr. Chung Seung-jun develops high-speed powerless photothermal effect temperature sensor technology using a transparent polymer thermoelectric material printing process.
Micron Appoints Mark Montierth as Corporate Vice President and General Manager of Mobile Business Unit
Micron Technology, Inc. today announced the appointment of Mark Montierth to the role of corporate vice president and general manager of its Mobile Business Unit.
Etron Receives Recognition for Long-standing Commitment to Innovation and R&D in Technology Commercialization
The Hsinchu Science Park 42nd Anniversary Gala Dinner, with the theme titled “Innovation as the Driving Force, Sustainability as the Focal Point,” took place recently, where a host of top-performing companies received commendation during the grand event.
Magnachip Introduces 8th-Gen 150V MXT MOSFET for Light Electric Vehicles
Magnachip Semiconductor Corporation announced today that the company has launched its eighth-generation 150V MXT Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) optimized for Light Electric Vehicle (LEV) motor controllers and battery management systems (BMSs).
A Greener Internet of Things with No Wires Attached
Emerging forms of thin-film device technologies that rely on alternative semiconductor materials, such as printable organics, nanocarbon allotropes and metal oxides, could contribute to a more economically and environmentally sustainable internet of things (IoT), a KAUST-led international team suggests.
Akoustis Receives First 5G Mobile BAW Filter Design Win from Tier-1 RF Component Company
The filter solution leverages one of Akoustis’ new wafer-level-packages (WLP), developed and manufactured its Canandaigua, New York fab
Electronics Value Chain is Still in Transition, and Uncertainty Continues to Cloud the Market Outlook
In an increasingly volatile world, the power of intelligence helps companies increase resiliency.
Wafer-Thin Device Has Potential to Transform the Field of Islet Cell Transplantation
Implantable platform provides prolonged treatment of Type 1 diabetes.
NIST and AIM Photonics Team Up on High Frequency Optical/Electronic Chips
Collaborative effort will enable new chip designs for high-speed communications.
