Enablence Technologies Inc. and Noel Technologies announced today a strategic partnership designed to substantially ramp production of Enablence’s planar lightwave products at its Fremont, California wafer fab.
Intel Surpasses First 2030 Goal: $2 Billion in Diverse Supplier Spending
Early success boosts Intel’s commitment to strengthening supplier diversity in the semiconductor ecosystem.
Littelfuse Appoints Dr. Greg Henderson to Board of Directors
Littelfuse, Inc. announced today the appointment of Dr. Greg Henderson to the company’s board of directors, effective May 15, 2023.
Advanced Semiconductor Packaging Technologies: The Development Trend and the Growth Drivers, IDTechEx Reports
Advanced semiconductor packaging technologies are crucial due to the slowing of Moore’s law and rising costs of monolithic Si IC development and manufacturing.
SEMI FlexTech Invites Proposals for Flexible Hybrid Electronics Innovations
Selected projects will receive cash awards ranging from $250,000 to $1 million. The program is funded by the Army Research Laboratory (ARL).
Purdue and India Establish Milestone Semiconductor Alliance
Purdue University continues to rapidly expand its global boundaries in semiconductors, announcing a transformative agreement to become the flagship academic partner and collaborator with the government of India.
Electronics Industry Welcomes Reintroduction of Bipartisan Proposal to Boost U.S. Printed Circuit Board Sector
The electronics manufacturing industry is welcoming the reintroduction of bipartisan legislation in the U.S. Congress that would help rebuild the country’s printed circuit board (PCB) sector.
Cadence Appoints Mary Louise Krakauer as Chair of the Board
Cadence Design Systems, Inc. today announced that current Cadence board member, Mary Louise (ML) Krakauer, has assumed the role of chair of the board, effective May 4, 2023.
Samsung Develops Industry’s First CXL DRAM Supporting CXL 2.0
Samsung Electronics Co. Ltd. today announced its development of the industry’s first 128-gigabyte (GB) DRAM to support Compute Express Link (CXL) 2.0. Samsung worked closely with Intel on this landmark advancement on an Intel Xeon platform.
Entegris Opens Manufacturing Facility in Kaohsiung, Taiwan
The 54,000-square-meter facility will be Entegris’ largest manufacturing facility producing solutions critical to chipmakers.
