Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

Microchip Plans to Invest $880 Million to Expand its Silicon Carbide (SiC) and Silicon (Si) Capacity in Colorado

Ramping up production at its Colorado Springs fabrication campus will enable Microchip to respond to growing semiconductor demand across a wide swath of industries.

Veeco Acquires Epiluvac AB

Veeco Instruments Inc. today announced that on January 31, 2023, it acquired Epiluvac AB, a privately held manufacturer of chemical vapor deposition (CVD) epitaxy systems that enable advanced silicon carbide (SiC) applications in the electric vehicle market.

Aerotech Continues Capacity Expansion

Aerotech Inc.announced today that it is more than doubling its cleanroom space to support future growth.

Winbond joins UCIe Consortium

Winbond has joined the UCIe (Universal Chiplet Interconnect Express) Consortium, the industry Consortium dedicated to advancing UCIe technology.

SEMI Europe Honors Melexis, Warsaw University of Technology and Centera Labs Leaders for Contributions to Semiconductor Industry

SEMI Europe today announced recipients of the European SEMI Award and Special Service Award for 2022 at the SEMI Industry Strategy Symposium Europe (ISS Europe 2023). 

‘Lego-like’ Universal Connector Developed by NTU Singapore Scientists Makes Assembling Stretchable Devices a Snap

An international team led by researchers from Nanyang Technological University, Singapore (NTU Singapore) has developed a universal connector to assemble stretchable devices simply and quickly, in a ‘Lego-like’ manner.

TFT Strategy to Enhance Flexible Display Panel Performance

Advances in display technologies prompt the development of electronic products with foldable and flexible panels.

JEDEC Wide Bandgap Power Semiconductor Committee Publishes a Series of Documents for Reliability and Testing of Silicon Carbide (SiC) MOSFETs

The publications were developed by JEDEC’s JC-70.2 Silicon Carbide Subcommittee and are available for free download from the JEDEC website.

Cogniteam’s Nimbus Unifies Robot and Facility Sensor Integrations, Reducing Development Time by 60%

Unifying the full layout, from robots to infrastructure sensors, companies develop emerging autonomous use cases 60% faster. “Successful robot deployments demand a single development platform for both the machine and facility integrations,” said Dr. Yehuda Elmaliah, Co-Founder & CEO of Cogniteam.

Silicon Motion Launches Third Generation PCIe Gen4 SSD Controller for Future TLC and QLC 3D NAND Flash

Silicon Motion Technology Corporationtoday announced the SM2268XT, its latest high-performance PCIe Gen4 SSD controller solution optimized for higher speed NAND transfer rates.