Delivers AIoT (Artificial Intelligence of Things) edge technology for autonomous driving, robotics, and mobility AI vision surveillance management.
NCKU Researchers “Weave Single Crystal Thin Films” to Fabricate Twisted Epitaxial Lateral Homostructures
A team of researchers led by Prof. Jan-Chi Yang from National Cheng Kung University described how inserting a freestanding oxide layer assisted the generic approach for synthesizing epitaxial twisted oxide lateral homostructures.
Plasma-Therm Receives Follow-On Order in Japan for its Heatpulse RTP System
Innovative platform redesign enables device makers to make critical system upgrades for currently installed legacy systems without interrupting processes of record.
China Expects to Take More Than 50% Share of Unit and Area Shipments in Large Area Displays for the First Time
Shipments of large-area display in 2022 decreased by 8% year on year (YoY) in unit and 3% YoY.
2022 Semiconductor Materials Market Concludes as Another Solid Year Amid Rising Economic Challenges
TECHCET announced that the Total Semiconductor Materials market in 2022 is expected to top US$66 billion after strong semiconductor demand through the first three quarters of the year.
SEMI ISS Europe 2023 to Spotlight European Chips Act with Focus on Growth, Talent, Sustainability and Supply Chain
Leading analysts, economists, policymakers and technologists will gather at the SEMI Industry Strategy Symposium Europe (ISS Europe) 2023, February 15-16 in Vienna, Austria, to provide the latest insights into major forces impacting the global semiconductor industry.
Arizona State University to Advance Proposal for CHIPS and Science Act Funding
ASU will offer regionally collaborative proposal to advance microelectronics research, development and manufacturing in Arizona and southwest region as part of national network.
Applied Materials Breakthrough in Electron Beam Imaging Technology Accelerates Development of the World’s Most Advanced Computer Chips
Applied Materials, Inc. today announced the commercial availability of “cold field emission” (CFE) technology, a breakthough in eBeam imaging that enables customers to better detect and image nanometer-scale, buried defects to speed the development and production of next-generation Gate-All-Around (GAA) logic chips as well as higher-density DRAM and 3D NAND memories.
SEMI Taiwan Launches Rating Service to Strengthen Cybersecurity Across Taiwan Chip Ecosystem
Taking aim at hardening the Taiwan semiconductor ecosystem’s defenses against cyberattacks, SEMI has launched a Semiconductor Cybersecurity Risk Rating Service.
Applied Materials Awards Suppliers for Outstanding Performance
Applied Materials, Inc. today announced the recipients of Supplier Excellence Awards for contributions made to Applied’s business over the past year.
