Eyeris Technologies, Inc. announced today its collaboration with indie Semiconductor, an Autotech solutions innovator, on the integration of Eyeris’ advanced monocular 3D sensing AI software with indie’s intelligent vision processor system-on-chip (SoC) using 2D image sensors.
Amtech Systems Receives Large Repeat Order for Advanced Packaging Reflow Systems
Amtech Systems, Inc. announced today a multi-unit order for high volume reflow systems used in advanced packaging applications.
TANAKA Establishes New Overseas Subsidiary in Seoul, Korea
Establishing overseas subsidiary in Korea will invigorate transactions and expand business in the markets for fuel cell catalysts, power semiconductor materials, precursors, and precious metal recycling.
Navitas New Distribution Deal with Richardson Electronics Expands Americas Footprint for Next-Gen SiC Semiconductors
Partnership for advanced GeneSiC silicon carbide (SiC) targets renewable energy, industrial, medical, transportation, and energy storage.
Lattice Semiconductor Appoints Elizabeth Schwarting to Board of Directors
Lattice Semiconductor today announced the appointment of Elizabeth Schwarting to the Company’s Board of Directors and Nominating and Governance Committee effective March 14, 2023.
Silicon Labs Announces New Bluetooth SoC and MCU Ideal for Small Form-Factor Devices
Silicon Labs today announced two new integrated circuit families designed for the smallest form factor IoT devices: the xG27 family of Bluetooth systems on chips (SoCs) and the BB50 microcontroller unit (MCU).
Boston Semi Equipment Announces Record Orders
Boston Semi Equipment today announced its test handler backlog has reached a historical level and continues to grow.
Pusan National University Researchers Develop Novel Stackable Hole Injection Layer Material for Solution-processed OLEDs
Researchers have now developed a novel thermally cross-linkable poly(iminoarylene), a solvent-resistant hole injection layer material with excellent film-forming properties, optimum energy level and high mobility, a major stepping stone toward commercial viability of solution-processed OLEDs.
Henkel Delivers Versatile, High Thermal Die Attach Adhesive for Power IC Applications
Henkel today announced the availability of a die attach adhesive that provides high thermal capability to enable superior operation of power semiconductor packages.
New AI Model Transforms Understanding of Metal-Organic Frameworks
Researchers at EPFL and KAIST have created a transformer for Metal-Organic Frameworks (MOFs), a class of porous crystalline materials. By combining organic linkers with metal nodes, chemists can synthesize millions of different materials with potential applications in energy storage and gas separation.
