Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

StratEdge to Display Molded Ceramic Semiconductor Packages at the IMAPS Device Packaging, APEC, and GOMACTech Conferences

StratEdge Corporation will display its molded ceramic packages at the IMAPS Device Packaging, APEC, and GOMACTech conferences, all of which are being held in March.

Magnachip Unveils Super-Short Channel MXT MOSFETs for Smartphone Battery Protection Circuit Modules

Magnachip Semiconductor Corporation announced today that the company has released two seventh-generation MXT MOSFETs.

IDTechEx Discusses Emerging Applications for Silicon Photonics

In the report “Semiconductor Photonic Integrated Circuits 2023-2033”, IDTechEx takes a close look at photonic chip-scale systems.

EUV Tech Raises Series A Funding

Capital to accelerate EUV Tech product roadmap in support of leading-edge semiconductor lithography.

Scintil Photonics Demonstrates First Single Chip 100 GHz DFB Comb Laser Source at OFC 2023

Named SCINTIL Comb Laser Source, this is the first fully integrated single chip that achieves 100-GHz frequency spacing, which is half to one-quarter of the spacing available today.

Accellera Systems Initiative Posthumously Honors Phil Moorby with 2023 Technical Excellence Award

Mr. Moorby honored during DVCon U.S. 2023 for inventing Verilog HDL.

TUS Researchers Propose a Simple, Inexpensive Approach to Fabricating Carbon Nanotube Wiring on Plastic Films

The proposed method produces wiring suitable for developing all-carbon devices, including flexible sensors and energy conversion and storage devices.

JCET Provides Multiple Customers with Advanced Packaging HVM Solutions for 4D Millimeter-wave Radar

JCET Group recently announced the company provides multiple customers with advanced packaging HVM solutions for 4D millimeter-wave Radar, to meet the increasingly diversified and customized demands of automotive electronic applications.

SweGaN Launches Project for New Headquarters and Wafer Production Facility

The new facility will be built at the Innovative Materials Arena (IMA). IMA is cluster for innovative materials located in Linköping, Sweden, in Östergötland – a region renowned for its progressive materials industries.

2023 CMC Conference Announces Lineup of Speakers

Featuring talks on current trends, issues, and new technologies for the semiconductor materials supply chain.