Shannon Davis

News and Web Editor

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Shannon, writes, edits and produces Semiconductor Digest’s news articles, email newsletters, blogs, webcasts, and social media posts. She holds a bachelor’s degree in journalism from Huntington University in Huntington, IN. In addition to her years of freelance business reporting, Shannon has also worked in marketing and public relations in the renewable energy and healthcare industries.

The MOSIS Service of the USC Information Sciences Institute and SkyWater Collaborate on Silicon IC Design Enablement and Manufacturing Service

The MOSIS Service will provide multi-project wafer (MPW) shuttle access to SkyWater’s S90 and S130 mixed-signal CMOS technologies. 

Global Semiconductor Equipment Billings Increase 9% in Q3 2022, SEMI Reports

Global semiconductor equipment billings rose 9% from the second to the third quarter of 2022 and 7% year-over-year to US$28.75 billion, SEMI announced today.

STMicroelectronics and Soitec Cooperate on SiC Substrate Manufacturing Technology

STMicroelectronics and Soitec announce the next stage of their cooperation on Silicon Carbide (SiC) substrates, with the qualification of Soitec’s SiC substrate technology by ST planned over the next 18 months.

Making Sense of Coercivity in Magnetic Materials with Machine Learning

Scientists develop a meaningful approach to analyze how a material’s microstructure relates to its macroscopic physical properties.

Synopsys Appoints Shelagh Glaser Chief Financial Officer

Synopsys, Inc. today announced that it has appointed Shelagh Glaser as chief financial officer, effective December 2, 2022.

High Purity T-342 Diaphragm Valve Now Includes Sanitary Adapters Option

Asahi/America, Inc. now offers its T-342 diaphragm valves with optional sanitary adapter end connectors.

Henkel Non-Conductive Die Attach Film Offers Broad Wirebond Package Flexibility

Henkel today announced the commercialization of a high-performance non-conductive die attach film (ncDAF) engineered to address the demands of contemporary packaging device designs.

CVD Deposition, Plating and Sputter Target Materials Looking Strong Despite Threat of Semiconductor Market Slowdown

Advanced packaging and interconnect layers driving growth through ‘26.

After Record Sales in 2022, Semi Sales Forecast to Fall -5% in 2023

Collapsing memory prices and uncertain global economy weigh on next year’s growth.

Ixana Raises $3M with Breakthrough Wearable Silicon Chip

Ixana, the wearable hardware company developing high-speed human-computer interfaces, today announced it has closed $3 million in seed funding and is backed by Uncorrelated Ventures, Samsung Next, Evonexus, Paradigm Shift and Hack VC.