CEA-Leti today announced an open-source project to produce physical True Random Number Generators (TRNG) using ring-oscillator-based architectures.
Samsung Develops Industry’s First 24Gb GDDR7 DRAM for Next-Generation AI Computing
Samsung Electronics Co., Ltd. today announced it has developed the industry’s first 24-gigabit (Gb) GDDR7 DRAM.
Microchip’s RTG4 FPGAs with Lead-Free Flip-Chip Bumps Achieve Highest Space Qualification
QML Class V designation recognizes exceptional reliability and longevity for critical space missions.
TANAKA Announces “TK-SK” Palladium Alloy for Semiconductor Test Equipment
New palladium alloy with a Vickers hardness of 640HV reduces wear-related deformation of probe pins, contributing to longer service life and lower costs for semiconductor test equipment.
Infinera Receives CHIPS and Science Act Funds to Support Development of Semiconductor Technology Important for Communications and National Security
Today, the Biden-Harris Administration announced that the Department of Commerce and Infinera have signed a non-binding preliminary memorandum of terms (PMT) to provide up to $93 million in proposed direct funding under the CHIPS and Science Act.
Micron Fuels New Wave of AI PCs With Launch of Ultra-Fast Clock Driver DDR5 Memory Portfolio
Micron Technology, Inc., today announced the availability of a brand-new category of clock driver memory with the launch of its Crucial DDR5 clocked unbuffered dual inline memory modules (CUDIMM) and clocked small outline dual memory modules (CSODIMM), which are now shipping in volume.
Omdia: NexChip and Samsung Foundry lead LCD and OLED driver IC markets in 3Q24
Latest insights from Omdia’s Display Driver IC Market Tracker indicate that NexChip and Samsung Foundry have emerged as key leaders in the display driver IC (DDIC) market for 3Q24.
SEMI Energy Collaborative Releases Recommendations for Expanding Low Carbon Energy in Taiwan
SEMI, the global industry association representing the semiconductor and electronics design and manufacturing supply chain, today released a report by its Energy Collaborative (EC) with recommendations on expanding low-carbon energy (LCE) availability in Taiwan.
KLA Unveils Comprehensive IC Substrate Portfolio for a New Era of Advanced Semiconductor Packaging
Today KLA Corporation introduced the industry’s widest breadth of process control and process-enabling solutions for IC substrate (ICS) manufacturing.
Forge Nano Receives $10M Investment from GM Ventures
GM plans to utilize Forge Nano’s Atomic Armor surface engineering platform technology to pursue battery cathode material enhancements.
