onsemi today announced the successful completion of its acquisition of GlobalFoundries’ (GF’s) 300mm East Fishkill (EFK), New York site and fabrication facility, effective December 31, 2022.
Beyond Lithium: A Promising Cathode Material for Magnesium Rechargeable Batteries
Scientists discover the optimal composition for a magnesium secondary battery cathode to achieve better cyclability and high battery capacity.
MemryX Inc. and Edge Impulse Announce Partnership to Effortlessly Develop and Deploy AI on MemryX Edge AI Processors
MemryX Inc. announced it has formed a partnership with Edge Impulse, the AI-algorithm software provider, to streamline the development, testing, and deployment of AI models on MemryX’s advanced AI accelerator chips.
Lam Research Appoints Semiconductor Engineering Leader Dr. Ho Kyu Kang to Board of Directors
Lam Research Corp. today announced that Dr. Ho Kyu Kang has joined its board of directors, effective February 7, 2023.
Denton Vacuum Announces Third Order for Infinity FA Ion Beam Etch Delayering System
Denton Vacuum LLC announced today that they have won a third order for the Infinity FA failure analysis system from a leading global semiconductor memory device manufacturer.
Lorentz Solution Joins Intel Foundry Services (IFS) Accelerator EDA Alliance Program
Lorentz collaborates with Intel Foundry Services (IFS) to provide EDA tools and simulation solutions for silicon success and customers’ design needs.
Linton Crystal Technologies Announces Groundbreaking U.S. Manufacturing Investment
Linton Crystal Technologies (LCT), headquartered in Rochester, New York, announced today it will produce semiconductor and solar manufacturing equipment in the United States.
Make Them Thin Enough, and Antiferroelectric Materials Become Ferroelectric
Antiferroelectric materials have electrical properties that make them advantageous for use in high-density energy storage applications. Researchers have now discovered a size threshold beyond which antiferroelectrics lose those properties, becoming ferroelectric.
3D TSV Packages Market Size & Share to Surpass $14.9 Billion by 2028
The Global 3D TSV Packages Market is valued at $6.1 billion in 2021 and is projected to reach $14.9 billion by 2028 at a CAGR (Compound Annual Growth Rate) of 16.1% over the forecast period 2022-2028.
IDTechEx Explores Nine Startups Innovating Polymer Additive Manufacturing
Essential to understanding the evolution of the polymer 3D printing industry is exploring the change from low-cost printing technologies and materials to the slow growth and adoption of innovative polymer printing technologies and materials, from viscous thermosets to carbon fiber composites to foams.
