Notably, the IC market has never shown more than three sequential quarters of decline.
Creating Efficient Building Energy Management Systems from Room-Level Big Data
This study describes the first step of a scalable, bottom-up approach to developing energy-saving initiatives at the individual level.
Deci and Intel Collaborate to Accelerate Journey Towards More Scalable AI
With the power of Deci’s Automated Neural Architecture Construction (AutoNAC) technology, developers are better suited to build, optimize, and deploy more powerful deep learning models using Intel Chips.
Micron DDR5 Memory Now Available for 4th Gen AMD EPYC Processors
Micron Technology, Inc. today announced availability of DDR5 memory for the data center that is validated for the new AMD EPYC 9004 Series processors.
ACM Research Adds Metal Lift Off Capability to Ultra C pr Tool to Support Power Semiconductor Manufacturing and Wafer Level Packaging Applications
ACM Research, Inc. today announced that it has expanded its Ultra C pr product offering to include metal lift-off (MLO) capabilities for power semiconductor manufacturing and wafer level packaging (WLP) applications.
Nexperia Invests in Sustainable Alternatives to Batteries
Nexperia, the expert in essential semiconductors, today announced a broadening to its portfolio of power management products to include energy harvesting solutions.
Pearl Semiconductor Announces its SingleDie Technology for Timing Solutions
Pearl Semiconductor, a high-performance timing device company, today announced the first ever true single-die reference clock technology.
Trelleborg to Showcase Two New Isolast PureFab FFKM Materials at Semicon Europa 2022
Trelleborg Sealing Solutions showcases two new additions to its Isolast PureFab FFKM material range at Semicon Europa 2022 at Neue München, Munich, Germany, at booth number C1.842 from November 15 to 18.
Xiphera and Flex Logix Publish Joint White Paper on Solving the Quantum Threat with Post-Quantum Cryptography on eFPGA
Xiphera Ltd, a Finnish company designing and licensing cryptographic IP cores for FPGAs and ASICs, announced today that it has published a new white paper with Flex Logix.
ASE Breaks Ground on New Chip Assembly and Testing Facility in Penang, Malaysia
The new facility at ASE Malaysia (ASEM) will comprise 2 buildings (Plants 4 and 5) with a built-up area of 982,000 square feet, located in the Bayan Lepas Free Industrial Zone.
