A record high third quarter in the company’s history.
TSMC Launches OIP 3DFabric Alliance to Shape the Future of Semiconductor and System Innovations
TSMC today announced the Open Innovation Platform (OIP) 3DFabric Alliance at the 2022 Open Innovation Platform Ecosystem Forum.
ROHM’s New SerDes ICs for Automotive Multi-Displays Simplify Video Transmission
ROHM Semiconductor today announced new full-HD compatible (1980 x 1080 pixels) SerDes ICs optimized for multi-screen vehicle displays.
Micron Foundation, National Science Foundation and Schumer Announce $10 Million Commitment to Semiconductor Education
Micron Technology, Inc. and the Micron Foundation have announced a new partnership with the U.S. National Science Foundation (NSF), committing to a joint investment of $10 million to fund and develop semiconductor curricula in colleges and universities across the country.
GOWIN Semiconductor Partners with Metrics for Simulator Tool
GOWIN Semiconductor Corp, the world’s fastest-growing programmable logic company, is partnering with Metrics Design Automation to introduce DSim Cloud as part of GOWIN’s FPGA EDA solution.
New Report Identifies Target Areas for CHIPS R&D Investments
SIA-BCG study calls for new federal funds to be directed at five key areas of semiconductor R&D.
Novel Thin and Flexible Sensor Characterizes High-speed Airflows on Curved Surfaces
The multidirectional sensor developed by researchers from Japan can help improve the efficiencies of industrial-scale fluid machinery.
Micron and Governor Hochul Welcome President Biden to Central New York
Micron Technology, Inc. and Governor Kathy Hochul welcome President Joe Biden and other federal, state and local officials to Central New York where Micron plans to invest up to $100 billion over the next 20-plus years to build a leading-edge memory megafab.
AI-ALOE Brings AI-based Ecological Research Power To Local Technical College
During the summer, Duncan Hughes, an Environmental Technology instructor at North Georgia Technical College (NGTC) introduced his students to the web application Virtual Ecological Research Assistant, better known as VERA.
Cadence’s New Flow Automates Custom/Analog Design Migration on TSMC Advanced Technologies
Cadence Design Systems, Inc.collaborated with TSMC to develop a node-to-node design migration flow built upon the Cadence Virtuoso design platform for custom/analog IC blocks that use TSMC’s advanced process technologies.
