Partnership for advanced GeneSiC silicon carbide (SiC) targets renewable energy, industrial, medical, transportation, and energy storage.
Lattice Semiconductor Appoints Elizabeth Schwarting to Board of Directors
Lattice Semiconductor today announced the appointment of Elizabeth Schwarting to the Company’s Board of Directors and Nominating and Governance Committee effective March 14, 2023.
Silicon Labs Announces New Bluetooth SoC and MCU Ideal for Small Form-Factor Devices
Silicon Labs today announced two new integrated circuit families designed for the smallest form factor IoT devices: the xG27 family of Bluetooth systems on chips (SoCs) and the BB50 microcontroller unit (MCU).
Boston Semi Equipment Announces Record Orders
Boston Semi Equipment today announced its test handler backlog has reached a historical level and continues to grow.
Pusan National University Researchers Develop Novel Stackable Hole Injection Layer Material for Solution-processed OLEDs
Researchers have now developed a novel thermally cross-linkable poly(iminoarylene), a solvent-resistant hole injection layer material with excellent film-forming properties, optimum energy level and high mobility, a major stepping stone toward commercial viability of solution-processed OLEDs.
Henkel Delivers Versatile, High Thermal Die Attach Adhesive for Power IC Applications
Henkel today announced the availability of a die attach adhesive that provides high thermal capability to enable superior operation of power semiconductor packages.
New AI Model Transforms Understanding of Metal-Organic Frameworks
Researchers at EPFL and KAIST have created a transformer for Metal-Organic Frameworks (MOFs), a class of porous crystalline materials. By combining organic linkers with metal nodes, chemists can synthesize millions of different materials with potential applications in energy storage and gas separation.
IMAPS Advanced System-in-Package Conference is Now CHIPcon
The top global event for advanced Chiplet and Heterogeneous Integration Packaging (CHIP) technologies to be held in July 2023.
Intrinsic Semiconductor Technologies Secures $8.5M Investment to Solve the Memory Bottleneck for Data Hungry Applications
Innovative non-volatile memory technology from UCL spin-out will create a new generation of small devices with big brains that embed intelligence everywhere.
Micron Releases ‘We Are Micron’ 2022 Diversity, Equality and Inclusion Report
Initiatives creating readiness for the workforce of the future and highlighting ongoing commitment to diversity.
