The transaction is expected to close in the first quarter of 2023, subject to receipt of required regulatory approvals and other customary closing conditions.
Researchers Create a Low-Cost Sensor That Detects Heavy Metals in Sweat
The flexible copper sensor is made from ordinary materials: conductive copper adhesive tape, sheet of transparency film, paper label, nail varnish, circuit fabrication solution, and acetone.
Wearable Tech, AI and Clinical Teams Combine to Change the Face of Clinical Trial Monitoring
A multi-disciplinary team of researchers has developed a way to monitor the progression of movement disorders using motion capture technology and AI.
Scientists Enable Thinnest Quantum Light Source by New 2D Layered Materials
Recent advances in SPDC-based quantum light sources based on two-dimensional layered materials have been made by a team led by Prof. REN Xifeng from the University of Science and Technology of China (USTC), collaborating with Prof. QIU Chengwei and Dr. GUO Qiangbing from the National University of Singapore (NUS).
Improving Data Security for a Hybrid Society: Insights from New Study
Researchers develop a fast and efficient method for handling encrypted data in the cloud for Society 5.0.
Electronic System Design Industry Reports Revenue of $3.8 Billion in Q3 2022, ESD Alliance Reports
The four-quarter moving average, which compares the most recent four quarters to the prior four, rose 13.4%.
POET Technologies Announces a Strategic Collaboration with ADVA for Highly Integrated 4x100G Solutions
ADVA will use POET’s multi-engine transmit and receive chips in an innovative pluggable solution that packs the functionality of four independent 100Gbit/s interfaces into a single QSFP-DD housing.
SEMI Announces Election of Mary Puma, Axcelis Technologies CEO, as International Board Chair
SEMI today announced that its International Board of Directors has elected Mary Puma, president and CEO of Axcelis Technologies, as its new chairperson, effective immediately, in accordance with the association’s by-laws.
Silanna UV Introduces TO-Can Package Format for 235nm and 255nm UV-C LEDs
Silanna UV announced the release of two new products in its SF1 235nm and SN3 255nm series of UV-C LEDs: the SF1-3T9B5L1 and the SN3-5T9B5L1.
proteanTecs to Showcase Interconnect Reliability Monitoring at the Chiplet Summit
proteanTecs announced today that the company will exhibit and present at the first annual Chiplet Summit.
