NI today announced the acquisition of SET GmbH, long-standing experts in aerospace and defense test system development and recent innovators in power semiconductor reliability test.
Tata Consultancy Services and Renesas Partner to Open Innovation Center to Develop Next-Generation Semiconductor Solutions
Tata Consultancy Services and Renesas Electronics Corporation (Renesas), a supplier of advanced semiconductor solutions, announced the opening of a joint Innovation Center in Bengaluru and Hyderabad and to collaborate on radio frequency, digital and mixed-signal design and software development for innovative next generation semiconductor solutions catering to the needs of a wide range of industries.
SEMI North America Advisory Board Welcomes New Members From PEER Group, TEL US and TSMC
SEMI today announced the election of three new members to the SEMI North America Advisory Board (NAAB): Mike Kropp, President and CEO of PEER Group; Ben Rathsack, Vice President of Product and Technology Development at Tokyo Electron America, Inc. (TEL); and Peter Cleveland, Senior Vice President at Taiwan Semiconductor Manufacturing Company Limited (TSMC).
Chung-Ang University Researchers Fabricate Novel Flexible Supercapacitors on Paper
The researchers vertically integrate multiple gold electrodes within a single sheet of paper to create a super-dense energy storage device.
Omdia: 2022, A Record Year for Semiconductors That Feels Anything But
The semiconductor market reached an all-time high in 2022, with total revenue hitting $595.7B, just surpassing 2021’s record revenue of $592.8B.
JEDEC Creates New Automotive Steering Subcommittee
JEDEC Solid State Technology Association announces the formation of the JC-42.9 Automotive Steering Subcommittee responsible for investigating memory technologies and recommending solutions pertaining to automotive applications.
SRC Publishes Interim Microelectronics and Advanced Packaging Technologies Roadmap, Seeks Public Comments
Semiconductor Research Corporation (SRC), a world-renowned semiconductor research and workforce development consortium, released an interim report for the Microelectronic and Advanced Packaging Technologies (MAPT) Roadmap.
proteanTecs to Host Industry Experts for Panel Discussion on the Data Revolution of Semiconductor Production
The webinar features industry experts from Qualcomm, Microsoft Azure and Advantest and will be held on Tuesday, March 7 at 9 am PST/12 pm EST/6 pm CET.
StratEdge to Display Molded Ceramic Semiconductor Packages at the IMAPS Device Packaging, APEC, and GOMACTech Conferences
StratEdge Corporation will display its molded ceramic packages at the IMAPS Device Packaging, APEC, and GOMACTech conferences, all of which are being held in March.
Magnachip Unveils Super-Short Channel MXT MOSFETs for Smartphone Battery Protection Circuit Modules
Magnachip Semiconductor Corporation announced today that the company has released two seventh-generation MXT MOSFETs.
