Weebit Nano Limited, a developer of next-generation memory technologies for the global semiconductor industry, has made significant progress in its selector development with new results confirming its ReRAM selector is suitable for both embedded and discrete (stand-alone) applications, greatly increasing the number of possible applications for Weebit’s technology.
Aehr Receives Order from New Customer for FOX Wafer Level Burn-in System for Silicon Carbide Semiconductors
Aehr Test Systems today announced it has received purchase orders from a new customer for a FOX-NP multi-wafer test and burn-in system, multiple WaferPak Contactors and a FOX WaferPak Aligner to be used for qualification of their silicon carbide devices for electric vehicles. The order for WaferPaks from this customer was announced during Aehr’s earnings conference call last week. This company is a multibillion-dollar annual revenue global manufacturer of semiconductors that is currently supplying silicon based MOSFETs for the automotive industry.
TSMC Results Irrelevant, as U.S. Ban on Chip Technology Exports to China Will Define Semiconductor Sector in 2023
Following the news that TSMC reported strong Q3 2022 results; Josep Bori, Thematic Research Director at GlobalData, offers his view.
Achronix Appoints Mahesh Karanth as CFO
Achronix Semiconductor Corporation announced it has named semiconductor industry veteran, Mahesh Karanth, as its chief financial officer.
Advanced Semiconductor Packaging Technologies in Data Centers: The Growth Drivers and the Cutting-Edge Use Cases
Growth drivers of advanced semiconductor packaging technologies on data center applications, as well as give several examples of cutting-edge commercial server products that adopt advanced semiconductor packaging technologies.
U.S. Government to Fund Expansion of IP Ecosystem for SkyWater’s 90nm Rad-Hard Platform
SkyWater Technology today announced the Department of Defense (DOD) is investing $12 million to expand the intellectual property (IP) ecosystem for the company’s 90nm radiation-hardened (rad-hard) by process offering, as part of the previously announced $27 million investment.
Research University Selects Veeco’s New Integrated Molecular Beam Epitaxy and Atomic Layer Deposition System
Veeco Instruments Inc. announced today that it has received an order from Justus Liebig University Giessen (University of Giessen) for an integrated GENxplor R&D Molecular Beam Epitaxy (MBE) and Fiji Atomic Layer Deposition (ALD) system.
Lockheed Martin, Ayar Labs Partner to Advance Microchip Connectivity for Next Generation Sensory Systems
Lockheed Martin, (NYSE: LMT) and Ayar Labstoday announced a strategic collaboration to develop future sensory platforms that leverage Ayar Labs’ advanced optical I/O microchips that use light to transfer data faster, at a lower latency, and at a fraction of the power of existing electrical I/O solutions.
Graphene Boosts Flexible and Wearable Electronics
New Caltech research demonstrates how the honeycombed material can enhance electronics.
Samco Unveils Plasma Enhanced ALD System for SiC and GaN Power Devices
Samco launches the new Plasma Enhanced Atomic Layer Deposition (PEALD) system, “AD-800LP”.
