The eBeam Initiative, a forum dedicated to the education and promotion of new semiconductor manufacturing approaches based on electron beam (eBeam) technologies, today announces the addition of two new company members to the organization.
MITRE Engenuity and Semiconductor Alliance Position Paper Outlines Guidance for National Semiconductor Technology Center Incubation
Ensuring the United States improves its global competitiveness in semiconductors requires strategic deployment of the $52.7 billion in funding authorized in the CHIPS + Science Act.
Arteris and SiFive Partner to Accelerate RISC-V SoC Design of Edge AI Applications
Arteris, Inc. and SiFive, Inc. today announced their partnership to help speed up Edge AI electronic product innovation for consumer electronics and industrial applications.
Samsung, Micron, and SK Hynix Account for Three-Fourths of Leading-Edge Wafer Capacity
At the end of 2022, Samsung, Micron, and SK Hynix accounted for 76% of leading-edge capacity, with the vast majority of it for advanced DRAM and 3D NAND production.
Semiconductor Wet Chemicals 1H2023 Trending Down
Although 200+ new layer chip offerings are expected in 2023.
Applied Materials’ Pattern-Shaping Technology Reduces the Cost, Complexity and Environmental Impact of Advanced Chip Manufacturing
Applied Materials, Inc. today unveiled a breakthrough in patterning technology that allows chipmakers to create high-performance transistors and interconnect wiring with fewer EUV lithography steps, thereby lowering the cost, complexity and environmental impact of advanced chipmaking.
Infinitesima Announces First Customer Shipment of Metron3D In-Line Probe Metrology System
Infinitesima have completed the first customer shipment of the Metron3D metrology system, a revolutionary sub-nanometer, high speed 3D imaging system that operates at in-line production throughputs.
Applied Materials’ New eBeam Metrology System Paves the Way to High-NA EUV Lithography
Applied Materials, Inc. today introduced a new eBeam metrology system specifically designed to precisely measure the critical dimensions of semiconductor device features patterned with EUV and emerging High-NA EUV lithography.
ACM Research Receives Purchase Order for SAPS Tool from Major European Global Semiconductor Manufacturer
The tool is expected to be shipped to the prospective customer’s European facility in the fourth quarter of 2023.
Intel Showcases New 5G Products at MWC 2023
Today, Intel announced a range of products and solutions driving this transition and broad industry support from leading operators, original equipment manufacturers (OEMs) and independent software vendors (ISVs).
